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ADVANCED INTERCONNECTIONS CORP. Advanced’s screw-machined terminals are the heart of their high-reliability through-hole board-to-board connectors. Standard options include single-, dual-, and triple-row designs with a wide variety of terminal styles, pitches, platings, stack heights, and insulator materials, in addition to customized designs and SMT options.
AVNET
Amphenol ICC’s ExpressPortTM QSFP+ interconnect system features a 38-position, 0.8mm-pitch SMT connector and a single, ganged, or stacked press- t cage. Each port has four data channels capable of up to 28Gb/s GbE, Ini niBand, or SONET/SDH, and provides higher port density and cost savings than traditional SFP+ products.
AVX INTERCONNECT
AVX’s Insulation Displacement Contact (IDC) Technology Selector Guide features summary speci cations and datasheet links for 12 series — including cost- and size-saving STRIPTTM insulator-less contacts — that offer high-reliability, cold-welded wire terminations for 12–28AWG solid, stranded, and bare wires in harsh environments.
FISCHER CONNECTORS
MiniMaxTM miniature, circular, ultra-dense mixed signal and power connectors offer up to 75% weight savings and 45% space savings, are rated for up to 5,000 mating cycles, are tested for high- speed protocols including USB 3.0 and HDMI and data transfer up to 10Gb/s, and are ideal for rugged, space-constrained applications.
NICOMATIC
DLMM modular Micro-D Mix connectors are compact, lightweight, and cost-effective; feature rugged, metallized composite shells, built-in backshells, and a secure locking mechanism; are quali ed to MIL-DTL-83513G; provide superior EMI protection; and are ideal for weight- and space-constrained blind mating applications.
PA&E
PA&E’s hermetic Micro-D connectors have a 0.05” contact pitch, deliver excellent electrical performance and environmental characteristics, are compliant with MIL-PRF-83513, are available in non-magnetic and Mini-Micro versions, and
are compatible with lightweight aluminum and titanium and traditional iron/nickel alloy materials.
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