Page 19 - kV-kA ABB_Broschure_Power_Semiconductors_2021_EN

LINPAK IGBT MODULES
19
Current IC (A)
Configuration
VCEsat (V) typ. 125 °C
VF (V) typ. 125 °C
Housing
2 x 1000
(5) – Phase leg IGBT
2.55
1.75
X
2 x 450
(5) – Phase leg IGBT
3.1
2.25
X
Part number
Tvj (operational) up to 175 °C
5SNG 1000X170300
5SNG 0450X330300
Voltage VCES (V)
1700 3300
Please refer to page 59 for part numbering structure. Configurations on page 22
Current ID (A)
Configuration *
RDS(on) (mΩ) typ. 25 °C
RDS(on) (mΩ) typ. 150 °C
Housing
2 x 900
(5) – Phase leg MOSFET
2.8
4.8
X
2 x 1800
(5) – Phase leg MOSFET
1.4
2.4
X
2 x 500
(5) – Phase leg MOSFET
3.6
6.6
X
2 x 1000
(5) – Phase leg MOSFET
1.9
3.5
X
Part number
5SFG 0900X170100 * 5SFG 1800X170100 * 5SFG 0500X330100 * 5SFG 1000X330100 * * Contact factory
X
Voltage VDSS (V)
1700 1700 3300 3300
100
14.5
27.5
38 29.5
86
82
46
4
4x M3 screwing depth max. 6
6x M3 screwing depth max. 6
6x M8 screwing depth max. 16
ISO 2768-mK
Unless otherwise specified general tolerance class according to: All dimensions in millimeters
We reserve all rights in this document and in the information contained therein. Reproduction, use or disclosure to third parties without express authority is strictly forbidden. c 2015 ABB Switzerland Ltd Produced using Inventor
8.5 14.5
Dimensions in mm
Prepared by: Revised by: Checked by: Approved by: Replaces:
20.01.2016 19.07.2016 24.08.2016 24.08.2016
CHDOTRU1 CHDOTRU1 CHFAFIS1 CHANBER1
Article No. / Description
-
Outline Drawing
Scale 1:1
Format A2 Filename
Sheet 1
No. of Sh. 1
ABB Switzerland Ltd LinPak LV Semiconductors
Document No.
5SZL 0524 02
058172.idw Revision
4x 6.5
29.5 5 13
18
16.5
140
127 118
53.5
5
18