Page 175 - PCMI Journal December 2020
P. 175
PCM Educational Session for Colleges and New Staff
Presented by: David M. Allen, Emeritus Professor of Microengineering, Cranfield University, UK
11/23/20
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Once the photoresist has been imaged to produce an etchant –resistant patterned coating, chemical etching is used to transfer that pattern into the metal by selective removal as shown in the following animation.
Multiple profile production in a metal of thickness, T.
Photoresist
Temporary mask
T
Single-sided aperture
Double-sided mirror image aperture
Registered, dissimilar images
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Issue 136 December 2020 PCMI Journal 175
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