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MULTILAYER CERAMIC CAPACITORS





                                                   目錄  (Catalog)

            1.  適用範圍  (Scope) .............................................................................................................................................................. 3
            2.  規格描述  (Part Numbering System) ................................................................................................................................... 3
            3.  尺寸描述  (Dimensions) ..................................................................................................................................................... 3
                           晶片尺寸 ............................................................................................................................................................ 3
                           Chip Size ............................................................................................................................................................. 3
                           卷裝數量 ............................................................................................................................................................ 3
                                         容值公差 ............................................................................................................................... 3
                                         Capacitance ............................................................................................................................. 3
                                         Tolerance ................................................................................................................................ 3
                           電介質 ............................................................................................................................................................... 3
                           Dielectrics ............................................................................................................................................................ 3
                           電容容值 ............................................................................................................................................................ 3
                           Capacitance .......................................................................................................................................................... 3
            4.  容值範圍  (Capacitance Range) ............................................................................................................................................ 4
            4.1 容值編號定義 ..................................................................................................................................................................... 4
                                4.3.1 超高頻率電容器容值、Q 值、DF 值與頻率變化關係(RF capacitance、Q value、and DF value vs
                                frequency) ............................................................................................................................................. 11
            5.適用溫度範圍  (Operating Temperature Range) ................................................................................................................... 12
            6.儲存條件  (Storage).............................................................................................................................................................. 12
            7.晶片電容電性特性及測試條件  (Specifications and Test Conditions) .............................................................................. 12
            7.1  容值  (Capacitance, Cp)................................................................................................................................................... 12
                           7.2 散逸因素  (Dissipation Factor, DF) .......................................................................................................... 13
                           7.3 絕緣阻抗  (Insulation Resistance , IR) ...................................................................................................... 14
                           7.4 耐電壓  (Dielectric Strength, Flash) .......................................................................................................... 14
                           7.5 容值與直流電的關係  (DC Voltage Coefficients) ................................................................................... 14
                           7.6 DF 與交流電電壓的關係  (AC Voltage Coefficients) .............................................................................. 14
                           7.7 容值與時間的關係  (Aging Rate) ........................................................................................................... 15
            8.產品可靠度測試  (Product Reliability Tests) ...................................................................................................................... 15
                           8.1  崩潰電壓  (Breakdown Voltage, BDV) .................................................................................................... 15
                           8.2 應力測試  (Break Strength) ...................................................................................................................... 16
                           8.3 抗曲繞測試  (Bending) ............................................................................................................................ 16
                           8.4 焊錫性測試  (Solderability) ..................................................................................................................... 17
                           8.5 抗焊熱震  (Resistance to Soldering Heat, RSH) ........................................................................................ 17
                           8.6 溫度循環測試  (Temperature Cycling Test) ............................................................................................. 18
                           8.7 溫度循環耐濕性測試(Damping heat cycliing) ........................................................................................ 18
                           8.8 壽命測試  (Life Test) ............................................................................................................................... 19

            9.積層式陶瓷電容使用注意事項  (Precautions on the use of MLCC) .................................................................................... 21
                           9.1 有效的焊錫表面  (Suggested soldering profile) ....................................................................................... 21
                                9.1.1 手工焊(Hand soldering) ............................................................................................................... 21
                                9.1.2 焊錫(Soldering) ............................................................................................................................ 21
                           9.2 自動貼片注意事項  (Consideration for automatic placement) .............................................................. 23
                           9.3  印刷電路板設計  (PCB design) .............................................................................................................. 24
                                9.3.1 印刷電路板設計(PCB design) .................................................................................................... 24
                                9.3.2  板面排列設計(Pattern Configurations) ....................................................................................... 24
                                9.3.3.焊錫點設計(Design of Land-patterns) .......................................................................................... 25

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            (2016/08/10 revised)
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