Page 40 - 2021 Connectivity Components: Everything but the Connectors eBook

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Another reason for using hard-wired sensors would be to meet the radio frequency (RF) challenges of environments such as noisy industrial installations. Although many IoT applications will not use external antennas, they can often prove ideal in these difficult RF environments where more reliable communications are required than could be provided by wireless sensors.
Even though Wi-Fi, Bluetooth, and Zigbee cannot provide trouble-free connections over long distances, these technologies can enable fast and easy RF integration into connected systems, making them ideal for helping compact devices provide high-performance internet and data connectivity. For example, Molex offers a range of 2.4 GHz/5 GHz and 900 MHz ultra-thin ceramic and LDS/MID IoT antennas alongside their associated connectors. Molex also offers complete RF solutions for high frequency performance while delivering superior signal integrity, even in extremely demanding environments. Available in ultra-microminiature format (with a profile as low as 1.8 mm) as well as larger RF units, Molex’s coaxial connectors and cable assemblies operate across a range of frequencies – from DC to 65 GHz.
Different connectors for different needs
Of course, a myriad of connectors offer a range of features suited to IoT applications and selecting the right connector is critical, not only in terms of delivering the required level of performance but also for keeping the footprint of IoT nodes and sensors to an absolute minimum.
Although soldering memory directly to a board will minimize space, it can also limit flexibility. With this in mind, many engineers choose memory modules, allowing them to expand the available memory should they need additional processing or other options. Both Molex and TE Connectivity offer excellent solutions in this area, with ranges of memory connectors and custom memory modules for server, storage, and communication applications catering to different customer requirements.
Often, designers of IoT systems stack boards to allow flexibility, such as connecting different sensors to a standard communications board. The free height board- to-board connectors produced by TE Connectivity are designed for such parallel board stacking applications. Ideal for downsizing applications, these versatile units use sub-miniature connectors and are suitable for a broad spectrum of interconnect uses.
The free height connectors offer a range of position sizes, from 40 to 440 positions in contact pitches of 0.5 mm, 0.6 mm, 0.8 mm, and 1 mm. By mating various combinations of vertical plug and receptacle housing heights, board-to-board stack heights from 4 mm to 20 mm can be achieved in 1 mm increments. If further space savings are required, flexible board-to- board connections enable boards to be placed in any position that is best suited to minimizing a device’s footprint.