Page 3 - 2020 Interconnect Innovations eBook
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Welcome to our 2020 Interconnect Innovations eBook. This exciting new volume is our biggest special issue eBook yet, offering more than 100 pages of technical articles and product features that address evolving electronics market trends, next-gen connected electronics applications, innovative connectivity products, materials, and manufacturing capabilities, and connector specification and product design tips.
The 18 technical, tutorial articles collected here are authored by leading interconnect authorities working in the dynamic fields of smart connectivity, industrial automation, robotics, Industry 4.0, 5G, connected vehicles, electric vehicles, advanced air mobility, submersibles, assistive technologies, future soldier and combat systems, sensing, and fiber optics.
Our new 2020 Interconnect Innovations eBook also highlights a selection of 51 innovative and new-to-market connectivity solutions from 29 suppliers with proven experience developing and deploying high-performance interconnect products for these rapidly evolving market segments.
This special issue addresses many different markets, multiple application areas, and numerous connectivity technologies — including connectors, cable assemblies, sensors, antennas, materials, machine tools, and accessories. You’ll also notice several prevailing cross-market and -technology trends, including miniaturization, lightweighting, ruggedization, design flexibility, power efficiency, standards compliance, ease of use, durability, and high-speed, high-bandwidth, and high-signal- integrity data transmission.
Our new 2020 Mobility Connectivity eBook also highlights a selection of 45 specialized connectivity products designed to support the safe, reliable transmission of power and high-speed, high-signal- integrity data in harsh mobile equipment environments extending across the automotive, mil/aero, transportation, and industrial markets.
We hope you enjoy this fourth and final 2020 eBook and welcome you to share your comments with us via email or our LinkedIn, Twitter, and Facebook pages, as well as to share the issue link on yours.
Our next special issue eBook will focus on high-reliability, harsh-environment connectivity in military, aerospace, defense, industrial, energy, and medical market applications. Look for this release on March 30, 2021. In the meantime, please subscribe to our weekly e-newsletters, visit our website, follow us on social media, and check out our eBook archives for more applicable, expert-informed connectivity content.
Alice Tanghe Amy Goetzman Christine Stieglitz
Vice President & Managing Director Managing Editor Associate Managing Editor

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