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Modular Thermosyphon Test Bed for Cooling of Electronics
ME-E-51
Amit Silverstein; amitsilver94@gmail.com Gonen Gilad; gonigil92@gmail.com
Advisors: Dr. Izhak Ladizhensky1, Dr. Zuk N. Turbovich1 1SCE - Shamoon College of Engineering, Be’er-Sheva
Thermosyphon and heat pipe cooling systems use phase change and capillary action or gravity to efficiently transfer heat, offering passive thermal management without mechanical pumps. The goal of this project is to develop an experimental heat exchanger for measuring heat transfer over time. A modular system enables testing of different condenser geometries and includes transparent sections for visual observation of the working fluid’s behavior. Constructed from copper piping and components from the air conditioning industry, it will be tested with fluids like water and alcohol at up to 100°C under vacuum conditions. Our project addresses the growing need for effective cooling solutions driven by increasing thermal loads from advancements in computing, data centers, and electric vehicles.
Keywords: condenser geometry, electronics cooling, heat exchanger, heat pipe, gas-liquid separation, thermosyphon, thermosyphon loop
