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second design of microchannel setup which consists of eight times bigger outlet plenum volume as compared to inlet plenum volume. We perceive that if the inlet plenum volume is small and outlet plenum is larger then there will be a smooth flow of vapor in the downstream direction towards outlet plenum where enough volume is available for vapor to expand hence efficiency can be improved. We also observed that for the plain surface microchannel with the larger outlet plenum, the surface temperature reduces significantly along with lesser fluctuations in temperature, pressure and mass flux. Currently, some more sets of experiments are under process to test the effect of different outlet plenum designs along with nanostructure surface on performance. To get
Mr. Gaurav Hedau || 281
further insight into the physics of interactions of generated vapor on thermal performance, fluctuations and to optimize the design for high heat dissipation, three-dimensional simulations of the microchannel heat sink are currently in process.
Therefore, the above optimizations and design modifications of microchannel enhance the thermal performance and will give insight to further improve the design to meet the demandofhighheatdissipationfromthesmall surface area in the electronic industry. These microchannel heat exchangers are evolving to fulfill the future demand of high heat dissipation in electronics as well as in other areas of application like refrigeration system, fuel cells, and aerospace.