Page 216 - ASME IMECE 2015 Program

Technical Program TRACK 13 TRACK 13

2:09pm
Mems Wind Speed Sensor: Large Deflection of Curved Micro-Cantilever 13-15
Beam under Uniform Horizontal Force
Technical Paper Publication. IMECE2015-50560 QUALITY AND RELIABILITY IN ELECTRONICS AND PHOTONIC
PACKAGING
M. Amin Changizi, Intelliquip, Bethlehem, PA, United States, Ali Abolfathi,
Loughborough University, Loughborough, Leicestershire, United Kingdom,
Ion Stiharu, Concordia University, Montreal, Canada 13-15-1
QUALITY AND RELIABILITY IN ELECTRONICS AND PHOTONIC
PACKAGING
13-7
MICRO AND NANO DEVICES 380A 1:15pm–2:45pm

Session Chair: Justin A. Weibel, Purdue University, West Lafayette, IN, United
13-7-1 States
SENSORS Session Co-Chair: Suresh Sitaraman, Georgia Institute of Technology, Atlan-
ta, GA, United States, Susmita Dash, Massachusetts Institute of Technology,
Cambridge, MA, United States, Niru Kumari, Hewlett-Packard, Palo Alto, CA,
372F 1:15pm–2:45pm United States

Session Chair: Jie Xu, University of Illinois Chicago, Chicago, IL, United States 1:15pm
Session Co-Chair: Seok Kim, University of Illinois at Urbana–Champaign, Ur- A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue
bana, IL, United States
Reliability of SAC-Solder Joints Using Digital Image Correlation
Technical Paper Publication. IMECE2015-53476
1:15pm
A Tip-Tilt-Piston Micromirror with an Elastomeric Universal Joint Fabricat- Pradeep Lall, Kazi Mirza, Auburn University, Auburn, AL, United States
ed via Micromasonry
Technical Presentation. IMECE2015-50944 1:33pm
Addressing Thermal Management Concerns for a Power Electronics Mod-
Zining Yang, Seok Kim, University of Illinois at Urbana–Champaign, Urbana, ule Using an Integrated Micro-Cooling Chip Array Scheme
IL, United States
Technical Paper Publication. IMECE2015-53728

1:33pm George Papadopoulos, Stony Brook University, Stony Brook, NY, United
Design of Centrally Supported Biomimetic MEMS Microphone for Acous- States, Daniel Kearney, ABB Schweiz AG, Baden-Dattwill Aargau, Switzer-
tic Source Localization land
Technical Paper Publication. IMECE2015-51285
1:51pm
Asif Ishfaque, Byungki Kim, Korea University of Technology and Education, Structural Reliability of Novel 3-D Integrated Thermal Packaging for Pow-
Cheonan, Chungnam, Korea (Republic)
er Electronics
Technical Paper Publication. IMECE2015-53749
1:51pm
A Flexbile Pet-Based Tactile Sensor for Distributed-Load Detection and Its Sumeer Khanna, Patrick McCluskey, University of Maryland, College Park,
Robotics Application College Park, MD, United States, Michael Manno, University of Maryland,
Technical Paper Publication. IMECE2015-51986 College Park, Silver Spring, MD, United States, Bao Yang, Michael Ohadi,
Avram Bar-Cohen, University of Maryland, College Park, College Park, MD,
Jiayue Shen, Dan Wang, Old Dominion University, Norfolk, VA, United United States
States, Zhili Hao, Old Dominion University, Virginia Beach, VA, United States
2:09pm
2:09pm Board-Level Thermal Cycling Reliability of Underfilled Pb-Free PBGAs
The Effects of Material Properties on Pillar-Based QCM Sensors with and without Thermal Aging Effects
Technical Paper Publication. IMECE2015-52533 Technical Presentation. IMECE2015-50978

Hamed Esmaeilzadeh, University of Massachusetts Lowell, Lowell, MA, Unit- Tse Wong, Raytheon Company, El Segundo, CA, United States
ed States, George Cernigliaro, MicroChem Corp, Westborough, MA, United
States, Junwei Su, Lin Gong, Iman Mirzaee, Majid Charmchi, University of
Massachusetts, Lowell, Lowell, MA, United States, Hongwei Sun, University
of Massachusetts Lowell, Lexington, MA, United States 13-4
DESIGN AND FABRICATION, ANALYSIS, PROCESSES, AND
2:27pm TECHNOLOGY FOR MICRO AND NANO DEVICES AND SYSTEMS
Highly Sensitive Pressure Sensor Using Two-Dimensionally Aligned Car-
bon Nonotube Bundles
Technical Paper Publication. IMECE2015-53059 13-4-2
ANALYSIS, PROCESSES, AND TECHNOLOGY 2
Takuya Nozaki, Ken Suzuki, Hideo Miura, Tohoku University, Sendai, Miy-
agi, Japan

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