Page 168 - ASME IMECE 2017 Program
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ACKNOWLEDGMENT
TRACK : HEAT TRANSFER AND THERMAL ENGINEERING Track Organizers Qiuwang Wang, Xi’an Jiaotong University, Hua Bao, Shanghai Jiao Tong University,
Raj M. Manglik, University of Cincinnati, China China
United States Columbia Mishra, University of Texas, United Shannon K. Yee, Georgia Tech, United States
Subramanyaravi Annapragada, United States Yan Wang, University of Nevada, Reno, United
Technologies Research, United States Sandip Mazumder, Ohio State University, States
United States Michael Pettes, University of Connecticut,
Topic Organizers
Nesrin Ozalp, University of Minnesota Duluth, Aaron Wemhoff, Villanova University, United United States
States Sanjiv Sinha, University of Illinois, Urbana-
United States
Matthew R. Jones, Brigham Young University, Ashley F. Emery, University of Washington, Champaign, United States
United States Zhiting Tian, Virginia Tech, United States
United States Tengfei Luo, University of Notre Dame, United
Nick Roberts, Utah State University, United Darrell Pepper, UNLV, United States
Gerard Jones, Villanova University, United States
States Yanliang Zhang, University of Notre Dame,
Heng Ban, Utah State University, United States
Shima Hajimirza, Texas A&M University, United States
States Neil Zuckerman, Seagate Technology, United
Amitabh Narain, Michigan Tech University, United States
Xiuling Wang, Purdue University Northwest, States
United States Yanbao Ma, University of California Merced,
Patrick Hopkins, University of Virginia, United United States
Cheng-xian Lin, Florida International United States
States Chuanhua Duan, Boston University, United
Diana-Andra Borca-Tasciuc, Rensselaer University, United States
Elia Merzari, Argonne National Laboratory, States
Polytech Institute, United States Dong Liu, University of Houston, United
Chris Kobus, Oakland University, United United States
Chris Kobus, Oakland University, United States
States Xianming Dai, University of Texas at Dallas,
Nick Roberts, Utah State University, United States
Nesrin Ozalp, University of Minnesota Duluth, United States
States Keunhan Park, University of Utah, United
Xiulin Ruan, School of Mechanical United States
Chang Kyoung Choi, Michigan Technological States
Engineering and the Birck Nanotechnology Sandra Boetcher, Embry Riddle Aeronautical
Center, Purdue University, United States University, United States
Oronzio Manca, Università degli Studi della Nenad Miljkovic, University of Illinois at Univ, United States
Campania, Italy Gongnan Xie, Northwestern Polytechnical
Ming-Chang Lu, National Chiao Tung Urbana-Champaign, United States
University, Taiwan Jorge Alvarado, Texas A&M University, United University, China
Patrick Oosthuizen, Queen’s University, Bengt Sunden, Lund University, Sweden
Canada States Jiang Qin, Harbin Institute of Technology,
Steve Cai, Teledyne, United States Raj M. Manglik, University of Cincinnati,
Ryoichi Amano, University of Wisconsin- China
Milwaukee, United States United States Ali Khounsary, IIT – Chicago, United States
Chris Dames, University of California, Subramanyaravi Annapragada, United Albert Ratner, University of Iowa, United
Berkeley, United States
Dong Liu, University of Houston, United Technologies Research, United States States
States Tariq Shamim, Masdar Institute of Science &
Xiulin Ruan, School of Mechanical Session Organizers
Engineering and the Birck Nanotechnology Nesrin Ozalp, University of Minnesota Duluth, Technology, United Arab Emir.
Center, Purdue University, United States Vinod Srinivasan, University of Minnesota,
Sandra Boetcher, Embry Riddle Aeronautical United States
University, United States Rydge Mulford, Brigham Young University, United States
Blazo Ljubicic, HTRI, United States Abhijit Mukherjee, California State University
Gongnan Xie, Northwestern Polytechnical United States
University, China Matthew R. Jones, Brigham Young University, Northridge, United States
Sandra Boetcher, Embry Riddle Aeronautical Debjyoti Banerjee, Texas A&M University,
University, United States United States
Gongnan Xie, Northwestern Polytechnical S.A. Sherif, University of Florida, United United States
University, China Srinath Ekkad, Virginia Tech, United States
Ofodike Ezekoye, University of Texas, United States Riccardo Da Soghe, Ergon Research, Italy
States Yanliang Zhang, Boise State University, United Ajay Vadakkepatt, Qualcomm, United States
Albert Ratner, University of Iowa, United Victor Chiriac, Qualcomm, United States
States States Arjang Shahriari, University of Texas at Austin,
Tariq Shamim, University of Michigan Flint, Nick Roberts, Utah State University, United
United States United States
Hongbin Ma, University of Missouri, United States Portonovo Ayyaswamy, University of
States Lvrsv Prasad Chilamkurti, GMR Institute Of
Abhijit Mukherjee, California State University Pennsylvania, United States
Northridge, United States Technology, India Michael Pate, Texas A&M University, United
Phil Ligrani, University of Alabama In Amitabh Narain, Michigan Tech University,
Huntsville, United States States
Srinath Ekkad, Virginia Tech, United States United States Marissa Rylander, UT Austin, United States
Riccardo Da Soghe, Ergon Research, Italy Vaibhav Bahadur, University of Texas at Kashif Nawaz, Oak Ridge National Laboratory
Vaibhav Bahadur, University of Texas at
Austin, United States Austin, United States | ORNL, United States
Victor Chiriac, Qualcomm, United States Ming-Chang Lu, National Chiao Tung Xinwei Wang, Iowa State University, United
Marissa Rylander, UT Austin, United States
Xiaoming He, OSUMC, United States University, Taiwan States
Kashif Nawaz, Oak Ridge National Laboratory Xiulin Ruan, School of Mechanical Gerard Jones, Villanova University, United
| ORNL, United States
Michael Pate, Texas A&M University, United Engineering and the Birck Nanotechnology States
States Center, Purdue University, United States Aaron Wemhoff, Villanova University, United
Portonovo Ayyaswamy, University of Diana-Andra Borca-Tasciuc, Rensselaer
Pennsylvania, United States Polytech Instit, United States States
Sandip Mazumder, Ohio State University, Cheng-Xian Lin, Florida International
United States
Chris Kobus, Oakland University, United University, United States
States Xiuling Wang, Purdue University Calumet,
Oronzio Manca, Università degli Studi della
Campania, Italy United States
Patrick Oosthuizen, Queen’s University, Shima Hajimirza, Texas A&M University,
Canada
Van P. Carey, University of California, United United States
States Darrell Pepper, UNLV, United States
Sajjad Bigham, Michigan Technological Ashley F. Emery, University of Washington,
University, United States
Bolin Liao, University of California, Santa United States
Barbara, United States Jorge Alvarado, Texas A&M University, United
Yee Kan Koh, National University of
Singapore, Singapore States
Raj M. Manglik, University of Cincinnati,
United States
Subramanyaravi Annapragada, United
Technologies Research, United States
