Page 190 - ASME IMECE 2017 Program
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TRACK 11 MATeRiALs: geneTiCs To sTRuCTuRes – TuesdAY, noVeMbeR 7

     11-7 Material Processing of Flexible                                      11:42am – Tunable Electrical Conductivity and
     electronics, sensors, and devices                                         Piezoresistivity of Embossed Cellulose-Based Substrates
                                                                               Technical Presentation. IMECE2017-73436
     11-7-1 Material Processing of Flexible Electronics,                       Tongfen Liang, Xiyue Zou, Chuyang Chen, Jiaqi Liu,
     Sensors, and Devices I                                                    Wei-Jian Guo, Jingjin Xie, Max Tenorio, Rutgers University,
                                                                               Piscataway, NJ, United States, Daniel Sullivan, Rutgers
     Fourth Floor, Tampa Convention Center, Room 30A                           University, Highland Park, NJ, United States, Assimina
                                                              10:30am–12:15pm  Pelegri, Rutgers University, East Brunswick, NJ, United States,
                                                                               Aaron Mazzeo, Rutgers, The State University of New Jersey,
     Session Organizer: Aaron Mazzeo, Rutgers, The State                       Piscataway, NJ, United States
     University of New Jersey, Piscataway, NJ, United States
                                                                               11-16 Processing, structure and Property of
     Session Co-Organizers: Cunjiang Yu, University of Houston,                Polymers and Composites
     Houston, TX, United States, Karthik Shankar, University of
     Alberta, Edmonton, AB, Canada, Qiming Wang, University of                 11-16-2 Composite Processing and Properties
     Southern California, Los Angeles, CA, United States, Jianliang            First Floor, Tampa Convention Center, Room 20
     Xiao, University of Colorado Boulder, Boulder, CO, United
     States                                                                                                                                 1:30pm–3:15pm

     10:30am – Sustainable Materials Applied to Flexible                       Session Organizer: Frank J. Shih, Seattle University, Seattle,
     Electronics: The Case of Cellulose                                        WA, United States
     Invited Presentation. IMECE2017-73153
     Rodrigo Martins, Centre of Excellence in Microelectronics and             1:30pm – Processing Graphene-Reinforced Polymer Matrix
     Optoelectronics Processes (CEMOP) of Instituto de Novas,                  Nanocomposites by In Situ Mechanical Shear Exfoliation of
     Caparica, Portugal, Luís Pereira, CENIMAT, Caparica,                      Graphite at Varying Viscocity
     Portugal, Elvira Fortunato, University, Caparica, Portugal                Technical Presentation. IMECE2017-71624
                                                                               Arab Hussein, Zhizhong Dong, Jennifer Lynch, Bernard
     10:48am – Sustainable Materials Applied to Flexible                       Kear, Rutgers University, Piscataway, NJ, United States,
     Electronics: The Case of Cellulose II                                     Assimina Pelegri, Rutgers University, East Brunswick, NJ,
     Invited Presentation. IMECE2017-73275                                     United States, Stephen Tse, Rutgers MAE, Piscataway, NJ,
     Rodrigo Martins, Centre of Excellence in Microelectronics and             United States
     Optoelectronics Processes (CEMOP) of Instituto de Novas,
     Caparica, Portugal                                                        1:48pm – Applying Magnetic Consolidation Pressure During
                                                                               Cure to Improve Laminate Quality: A Comparative Analysis
     11:06am – Flexible AlGaN/GaN HEMT Based Radio                             of Wet Lay-Up and Vacuum Assisted Resin Transfer
     Frequency Power Amplifier on Biodegradable CNF                             Molding Processes
     Substrate                                                                 Technical Paper Publication. IMECE2017-72019
     Technical Presentation. IMECE2017-73444                                   Maya Pishvar, Mehrad Amirkhosravi, M. Cengiz Altan,
     Huilong Zhang, Tzu-Hsuan Chang, University of Wisconsin-                  University of Oklahoma, Norman, OK, United States
     Madison, Madison, WI, United States, Jinghao Li, USDA
     Forest Service, Madison, WI, United States, Kanglin Xiong,                2:06pm – Effect of Permeability on GFRP Laminate
     Yale University, New Haven, WI, United States, Jisoo Kim,                 Produced by VARTM Process
     Yei Hwan Jung, Jeongpil Park, Juhwan Lee, University of                   Technical Paper Publication. IMECE2017-72695
     Wisconsin-Madison, Madison, WI, United States, Jung Han,                  Sateesh Nagari, Gokaraju Rangaraju Institute of Engineering
     Yale University, New Haven, CT, United States, Zhiyong Cai,               and Technology, Hyderabad, India, Vengalrao Kundavarapu,
     USDA Forest Service, Madison, WI, United States, Shaoqin                  School of Mechanical Engineering, Vignan’s Foundation for
     Gong, Zhenqiang Ma, University of Wisconsin-Madison,                      Science Technology & Research, Guntur, India, Phaneendra
     Madison, WI, United States                                                Kumar Kopparthi, School of Mechanical Engineering, Guntur,
                                                                               AP, India
     11:24am – Gas Sensing Performance of Solution Processed
     TiO2 Nanotube Arrays                                                      2:24pm – Consolidation of Composite Laminates by
     Technical Presentation. IMECE2017-72945                                   Magnetic Pressure in Vacuum Assisted Resin Transfer
     Karthik Shankar, Yun Zhang, University of Alberta, Edmonton,              Molding: Modeling and Experiments
     AB, Canada, Samba Siva, Indian Institute of Technology-                   Technical Presentation. IMECE2017-73178
     Madras, Chennai, India, Najia Mahdi, University of Alberta,               Mehrad Amirkhosravi, Maya Pishvar, M. Cengiz Altan,
     Edmonton, AB, Canada, Subish John, Somnath Roy, Indian                    University of Oklahoma, Norman, OK, United States
     Institute of Technology-Madras, Chennai, India

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