Page 248 - ASME IMECE 2017 Program
P. 248
ACKNOWLEDGMENT
TRACK : MICRO AND NANO SYSTEMS ENGINEERING AND PACKAGING Track Organizers Muhammad Akbar, Tennessee State Junjun Ding, Alfred University, United
Jong Hyun Choi, Purdue University, University, United States States
United States Ayse Tekes, Kennesaw State University, Byoung Hee You, Texas State University,
Ioana Voiculescu, City College of New United States United States
York, United States Jungkyu Park, Kennesaw State Po-hao Huang, University of Arkansas,
University, United States United States
Topic Organizers
Jong Hyun Choi, Purdue University, Ioana Voiculescu, City College of New Aaron Mazzeo, Rutgers, State University
York, United States of New Jersey, United States
United States
Ioana Voiculescu, City College of New Nazmul Islam, University of Texas Rio Namwon Kim, Texas State University,
Grande Valley, United States United States
York, United States
Chandradip Patel, Schlumberger Wei Xue, Rowan University, United Grzegorz Hader, U.S. Army RDECOM-
States ARDEC, United States
Technology Corporation, United
States Byungki Kim, University of Daniel Kaplan, U.S. Army RDECOM-
Rasim Guldiken, University of South Massachusetts, United States ARDEC, United States
Florida, United States
Jong Hyun Choi, Purdue University, Seok Kim, University of Illinois at Nazmul Islam, University of Texas Rio
United States Urbana-Champaign, United States Grande Valley, United States
Ioana Voiculescu, City College of New
York, United States Jeong Tae Ok, Midwestern State Wei Xue, Rowan University, United
Byoung Hee You, Texas State University, University, United States States
United States
Aaron Mazzeo, Rutgers, The State Awlad Hossain, Eastern Washington Jeong Tae Ok, Midwestern State
University of New Jersey, United University, United States University, United States
States
Po-hao Huang, University of Arkansas, Ahsan Mian, Wright State University, Mosfequr Rahman, Georgia Southern
United States United States University, United States
Namwon, Kim, Texas State University,
United States Chandradip Patel, Schlumberger Hongwei Sun, University of
Mohammed Mayeed, Kennesaw State Technology Corporation, United Massachusetts Lowell, United States
University, United States States
Grzegorz Hader, U.S. Army RDECOM- Mohammad Robiul Hossan, University of
ARDEC, United States Hongwei Sun, University of Central Oklahoma, United States
Ibrahim Alhomoudi, King Abdulaziz City Massachusetts Lowell, United States
For Science and Tech, Saudi Arabia Michael Schertzer, RIT, United States
Daniel Kaplan, U.S. Army RDECOM- Michael Schertzer, RIT, United States
ARDEC, United States Mohammad Robiul Hossan, University of
Central Oklahoma, United States
Session Organizers
Ioana Voiculescu, City College of New
York, United States
Chandradip Patel, Schlumberger
Technology Corporation, United
States
