Page 64 - ASME IMECE 2017 Program
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TRACK 2 AdVAnCed MAnuFACTuRing – MondAY, noVeMbeR 6
2-2 Congress-wide symposium on Additive 2-4 Manufacturing of Atomically-Thin,
Manufacturing Two-dimensional Materials
2-2-2 Additive Manufacturing: Mechanical Modeling & 2-4-2 Mechanics of Two-Dimensional Materials
Testing First Floor, Tampa Convention Center, Room 2
First Floor, Tampa Convention Center, Room 1
1:30pm–3:15pm
1:30pm–3:15pm
Session Organizer: SungWoo Nam, University of Illinois
Session Organizer: Kurtis Ford, Sandia National Laboratories, Urbana-Champaign, Savoy, IL, United States
NM, United States
Session Co-Organizers: Chi Hwan Lee, Purdue University,
Session Co-Organizer: Nima Shamsaei, Auburn University, West Lafayette, IN, United States, Pilgyu Kang, George Mason
Auburn, AL, United States University, Fairfax, VA, United States
1:30pm – A Method to Determine Local Stress Fields in 1:30pm – Integrating Thermal Oxide Nanomembrane on
Microstructure Features Produced by Additive Flexible Electronics for Implantable Bio-Interface
Manufacturing Invited Presentation. IMECE2017-70788
Technical Paper Publication. IMECE2017-71392 Hui Fang, Northeastern University, Boston, MA, United States
Robert N. Saunders, U.S. Naval Research Lab, Washington,
DC, United States, Ajit Achuthan, Clarkson University, 2:06pm – Mechanical Instability-Driven Architecturing of
Potsdam, NY, United States, Amit Bagchi, U.S. Naval Atomically-Thin Materials
Research Laboratory, Washington, DC, United States Technical Presentation. IMECE2017-72236
SungWoo Nam, University of Illinois Urbana-Champaign,
1:48pm – Mechanical Behavior of As-Fabricated and Savoy, IL, United States
UV-Cured Lattice Structures Printed Using the CLIP
Technology 2:24pm – Liquid-Assisted Peeling 2D Nanomaterials
Technical Paper Publication. IMECE2017-70886 Technical Presentation. IMECE2017-72180
Anil Saigal, Tufts University, Medford, MA, United States, Baoxing Xu, University of Virginia, Charlottesville, VA, United
John Tumbleston, Hendric Vogel, Carbon3D, Redwood City, States
CA, United States
2:42pm – Crumpled and Kirigami-Inspired Functional
2:06pm – Analysis and Numerical Simulation of the Flexible Graphene Devices Fabricated by Commercial Tools
Mechanical Performance of FDM Samples with Variable Technical Presentation. IMECE2017-72353
Infill Values Keong Yong, University of Illinois Urbana-Champaign, Urbana,
Technical Paper Publication. IMECE2017-72226 IL, United States, Ali Ashraf, University of Illinois at Urbana
Steffany N. Cerda-Avila, Universidad Autonoma de San Luis Champaign, Urbana, IL, United States, Pilgyu Kang, University
Potosí, San Luis Potosí, Mexico, Hugo Ivan Medellin Castillo, of Illinois Urbana-Champaign, Urbana, IL, United States,
Univ Autonoma, San Luis Potosi, Mexico, Dirk De Lange, SungWoo Nam, University of Illinois Urbana-Champaign,
Universidad Autónoma De San Luis Potosí, Facultad De Savoy, IL, United States
Ingeniería, San Luis Potosí, Mexico
2-5 Advanced Machining and Finishing
2:24pm – Modeling and Experimental Characterization of
Viscoelastic 3D Printed Spring/Damper Systems 2-5-2 Advanced Surface Finishing and Grinding
Technical Paper Publication. IMECE2017-71957 First Floor, Tampa Convention Center, Room 3
Heather Lai, Cuiyu Kuang, Jared Nelson, SUNY New Paltz,
New Paltz, NY, United States 1:30pm–3:15pm
2:42pm – Friction Reducing Surface Textures Achieved by Session Organizer: Ramsey F. Hamade, American University
Additive Manufacturing of Copper Nanoparticles of Beirut, Beirut, Riad El Solh, Lebanon
Technical Presentation. IMECE2017-71071
Yang Wang, Xinjian Wang, Junyan Liu, Harbin Institute of Session Co-Organizers: Manyi Chen, Wuhan University of
Technology, Haerbin, China Technology, Wuhan, China, Philip Varghese, Norton/
Saint-Gobain, North-borough R&D Center, Northborough,
12 MA, United States
1:30pm – Analysis of the Effect of Open and Close Angle of
Workpiece Surface on Contour Error
Technical Paper Publication. IMECE2017-70021
Wei Wang, University of Electronic Science and Technology of
China, Chengdu, Sichuan, China, Qingzhao Li, Hai Li,
Yunfeng Jiang, Zhiyong Song, University of Electronic
Science and Technology of China, Chengdu, Sichuan, China
