Page 203 - ASME IMECE 2016 Program

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TRACK 13: MICRO- AND NANO-SYSTEMS ENGINEERING AND PACKAGING

13-10-1: Quality and Reliability in Electronics/Photonics Packaging
13-1-1: General Topics of MEMS/NEMS

13-12-1: Electronics and Photonics Packaging: Manufacturing Process, Materials, and Flexible Technologies
13-16-1: Advanced Packaging: Sensors and 3D/2.5D Packaging

13-17-1: Thermoelectric Devices and Thermal Modeling Techniques
13-17-2: Electronics and Photonics Thermal Management Technologies

13-18-1: Panel on Electrocaloric Cooling
13-18-2: High-Bandwidth Packaging Challenges in a Connected World

13-2-1: MEMS Plenary
13-3-1: Analysis, Processes, and Technology I

13-3-2: Analysis, Processes, and Technology II
13-4-1: Computational Studies on MEMS and Nanostructures –I

13-5-1: Applications of Micro and Nano Systems in Medicine and Biology
13-6-1: Analysis and Modeling

13-6-2: Sensors and Actuators
13-7-1: Mechanics of Micro and Nano Structures –I

13-7-2: Mechanics of Meso-Scale Structures TRACK 13: MICRO- AND NANO-SYSTEMS ENGINEERING AND PACKAGING
13-7-3: Mechanics of Micro and Nano Structures – II

13-8-1: MEMS-Enabled Phononic Microsystems
13-9-1: Biologically Enabled Microfluidics

13-9-2: Electrokinetic Modeling and Applications
13-9-3: Fluid Engineering in Micro-Systems