Page 211 - ASME IMECE 2016 Program

TRACK 13: Micro- and Nano-Systems Engineering and Packaging THU. NOV 17

TIME
1:15PM–3:00PM 13-17-2 ELECTRONICS AND PHOTONICS THERMAL MANAGEMENT TECHNOLOGIES
ROOM 223
Session Organizer: Hemanth Dhavaleswarapu, Intel Coporation, Chandler, AZ, United States
Session Co-Organizer: Krishna Kota, New Mexico State University, Las Cruces, NM, United States, Baris Dogruoz, CISCO, San Jose,
CA, United States, Vaibhav Bahadur, University of Texas at Austin, Austin, TX, United States, Arjang Shahriari, University of Texas at
Austin, Austin, TX, United States
1:15PM – Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling
Technical Paper Publication. IMECE2016-67320 – Jimil M. Shah, Syed Haider Imam Rizvi, The University of Texas at Arlington, Arlington,
TX, United States, Indu Sravani Kota, Sahithi Reddy Nagilla, Dhaval Thakkar, University of Texas at Arlington, Arlington, TX, United
States, Dereje Agonafer, The University of Texas at Arlington, Arlington, TX, United States
1:36PM – Heat Transfer in Liquid-Liquid Taylor Flow in Mini Scale Curved Tubing for Constant Wall Temperature
Technical Paper Publication. IMECE2016-67700 – Wesam Adrugi, Memorial University, St. John’s, NL, Canada, Yuri Muzychka, Kevin
Pope, Memorial University of Newfoundland, St. John’s, NL, Canada
1:57PM – Thermal Enhancement of An LED Light Engine for Automotive Exterior Lighting with Advanced Heat Spreader Technology
Technical Paper Publication. IMECE2016-65602 – Umut Uras, Mehmet Arik, Özyegin University, Istanbul, Turkey, Enes Tamdogan,
Ozyegin University, Istanbul, Turkey
2:18PM – Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Real Data Center Environment Utilizing Air-side
Economizer
Technical Paper Publication. IMECE2016-66199 – Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, The
University of Texas at Arlington, Arlington, TX, United States, Prabjit Singh, IBM Corporation, Poughkeepsie, NY, United States, Naveen
Kannan, Mike Kaler, Mestex, Division of Mestek, Dallas, TX, United States
2:39PM – Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
Technical Paper Publication. IMECE2016-67229 – Steven Isaacs, University of Colorado, Boulder, CO, United States, Diego Arias,
i2C Solutions, Louisville, CO, United States, Peter Hamlington, University of Colorado, Boulder, CO, United States, Derek Hengeveld,
LoadPath, Albuquerque, NM, United States
3:30PM–5:15PM 13-4-1 COMPUTATIONAL STUDIES ON MEMS AND 13-16-1 ADVANCED PACKAGING: SENSORS AND 3D/2.5D
NANOSTRUCTURES-I PACKAGING
ROOM 224A ROOM 223
Session Organizer: Muhammad Akbar, Tennessee State Session Organizer: Ankur Jain, University of Texas Arlington,
University, Nashville, TN, United States Arlington, TX, United States
Session Co-Organizer: Tonfiz U. Mahmood, The Boeing Session Co-Organizer: Leila Choobineh, SUNY Polytechnic
Company, Everett, WA, United States Institute, Uthica, NY, United States, Pritish R. Parida, IBM
Research, Yorktown Heights, NY, United States, Ercan Dede,
3:30PM – Effect of Geometric and Material Properties on Toyota Research Institute of North America, Ann Arbor, MI,
Thermoelastic Damping (TED) of Hemispherical Inertial United States, Karthik Bodla, GE Global Research, Niskayuna,
Resonator NY, United States
Technical Paper Publication. IMECE2016-66277 – Jiewen Liu,
Joshua Jaekel, Dharamdeo Ramdani, Nabeel khan, University 3:30PM – A Damage Free Micro-patterned Metal
of Windsor, Windsor, ON, Canada, David Ting, Univ Of Windsor, Interconnection for 3D Flexible Electronic Devices
Windsor, ON, Canada, Mohammed Jalal Ahamed, University of Technical Presentation. IMECE2016-65155 – Jun Yeob Song,
Windsor, Windsor, ON, Canada Yongjin Kim, Jae Hak Lee, Seung Man Kim, Korea Institute of
Machinery and Materials (KIMM), Daejeon, Korea (Republic)
3:51PM – Numerically Determining Material Coefficients of
Micro-injection Molded PVDF/PZT Piezoelectric Composites with 3:51PM – Experimental Measurement of Inter-Die Thermal
Controlled Filler Orientation Resistance in a Two Die 3D IC
Technical Paper Publication. IMECE2016-66600 – Can Yang, Technical Paper Publication. IMECE2016-65543 – Leila
Xiao-Hong Yin, Shiju E, Junwu Kan, Zhonghua Zhang, Dong Choobineh, SUNY Polytechnic Institute, Uthica, NY, United States,
Liang, Zhejiang Normal University, Jinhua, Zhejiang, China Ankur Jain, University of Texas Arlington, Arlington, TX, United
States, Jared Jones, University of Texas at Arlington, Arlington,
4:12PM – Adsorption-controlled Thermal Switch using TX, United States
Nonequilibrium Molecular Dynamics Simulation
Technical Paper Publication. IMECE2016-66707 – Tadeh 4:12PM – Crystallinity Control of Electroplated Interconnections
Avanessian, Gisuk Hwang, Wichita State University, Wichita, KS, for Improving Their Stability and Lifetime
United States Technical Paper Publication. IMECE2016-67737 – Jiatong Liu, Ken
Suzuki, Tohoku university, Sendai, Miyagi, Japan, Hideo Miura,
4:33PM – STUDY ON BONDING AND SHEAR FLOW Tohoku Univ, Sendai 980-8579, Miyagi, Japan
PHENOMENA OF SHEAR PROBE TEST FOR BGA SOLDER
JOINT IN NANO-SCALE ANALYSIS 4:33PM – Micron Level Placement of Nanowires via Real
Technical Paper Publication. IMECE2016-66773 – Bao-Hsin Time observation under Optical Microscope on a Desired
Liu, Yu-Liang Chen, Quang-Cherng Hsu, National Kaohsiung Nanochannel for Nanosensors Application
University of Applied Sciences, Kaohsiung, Taiwan Technical Paper Publication. IMECE2016-67969 –
Mohammadsadegh Beheshti, Junseo Choi, Louisiana State
4:54PM – Molecular Dynamics Study of Fast Ionic Transport in University, Baton Rouge, LA, United States, Xiaohua Geng,
Carbon Nanotubes Elizabeth Podlaha-Murphy, Northeastern University, Boston, IL,
Technical Presentation. IMECE2016-65364 – Xiang GAO, The United States, Sunggook Park, Louisiana State University, Baton
Hong Kong University of Science and Technology, Hong Kong, Rouge, LA, United States
China, Tianshou Zhao, Hong Kong Univ Of Science Tech,
Kowloon, China, Zhigang Li, Hong Kong University Of Science 4:54PM – Crystallinity-induced Degradation of the Lifetime of
And Technology, Kowloon, China Advanced Interconnections
Technical Paper Publication. IMECE2016-67619 – Takeru Kato,
Tohoku University, Sendai, Miyagi, Japan, Ken Suzuki, Tohoku 173
University, Sendai, Miyagi, Japan, Hideo Miura, Tohoku Univ,
Sendai 980-8579, Miyagi, Japan

IMECEProgram2016.indd 173 10/27/16 1:55 PM