Page 44 - ASME_SMASIS_2019_Program

Technical Sessions

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MONDAY, SEPTEMBER 9 • 3:40PM–5:40PM

3:40PM 4:00PM 4:20PM 4:40PM 5:00PM 5:20PM
Level 3, Malt
Symposium 2 Mechanics & Behavior of Active Materials

2-4 Multifield Response and Modeling II 3:40PM–5:40PM

Session Organizer: Ryan L. Harne, Ohio State University, Columbus, OH, United States

3:40PM Modeling Strain- 4:00PM Electro-Mechanical 4:20PM Mechanical and 4:40PM Experimental 5:00PM Mechanical and
Mediated Magnetoelectric Response of a Nanocomposite Electrical Characterization Findings of Structural Noise Electrical Characterization
Near-Field Electrospun Piezoelectric of PVDF and PVDF-TrFE Reduction in High Lift Devices of PVDF and PVDF-TrFE
Communication Devices Microfiber Additively Manufactured Using Shape Memory Additively Manufactured
Structures Alloy Inserts Structures
Technical Presentation. Technical Paper Publication.
SMASIS2019-5638 SMASIS2019-5686 Technical Presentation. Technical Presentation. Technical Presentation.
SMASIS2019-5711 SMASIS2019-5529 SMASIS2019-5773
John Domann, Virginia Krishna Chytanya Chinnam,
Tech, Blacksburg, VA, United Arnaldo Casalotti, Giulia Niknam Momenzadeh, Andrew Leaton, William Niknam Momenzadeh,
States, Joseph Schneider, Lanzara, University of Roma Tre, Masoud Derakhshani, Thomas Scholten, Texas A&M University, Masoud Derakhshani, Thomas
Greg Carman, University of Rome, Italy Berfield, University of Louisville, College Station, TX, United Berfield, University of Louisville,
California, Los Angeles, Los Louisville, KY, United States States, Kevin Lieb, MAESTRO
Angeles, CA, United States Laboratory, College Station, TX, Louisville, KY, United States
United States, Travis Turner,
NASA Langley Research Center,
Hampton, VA, United States,
Darren Hartl, Texas A&M,
College Station, TX,

United States