Page 18 - ASME ISPS 2016 Program

IoT Technical Session TUESDAY, JUNE 21

KEYNOTE ADDRESS COFFEE NETWORKING BREAK KEYNOTE ADDRESS
Grand Ballroom BCD 8:00am – 9:15am Grand Ballroom Foyer 11:00am – 11:15am Grand Ballroom BCD 12:45pm – 2:15pm

Translating IoT Into Innovation at Every Level. A Public-Private Research Proposal in Response to the Semiconductor
Industry Challenges - SRC Taking the Lead
Prith Banerjee, Schneider Electric DATA CENTER 2
Grand Ballroom E 11:15am – 12:45pm Ken Hansen, Semiconductor Research Corporation (SRC)
For more information see page 12
For more information see page 12
Data Center: Backbone for the Internet of Things
DATA CENTER 1
Grand Ballroom E 9:30am – 11:00am Mani Prakash, Intel Corp RELIABILITY AND AVAILABILITY FROM PACKAGING POV
A TCO-Based Design Approach For Evaluating IOT Data Center Seattle 2:15pm – 3:45pm
Efficiency Technologies
Energy Efficiency Optimization in Data Centers as We Gear Up for IOT
and Other Major Data Centers Growth Drivers Ali Heydari, Baidu Can Either Physics of Failure or Big Data Provide a Silver Bullet to
Improve the Availability of Complex Electronic Systems?
Bahgat Sammakia, Kanad Ghose, SUNY Binghampton Enabling IoT Growth Through Energy Efficient Data Centers
Abhijit Dasgupta, University of Maryland
IoT Centric Data Center - Challenges, Risks and Options for the Future Yogendra Joshi, Georgia Tech
Packaging Solutions for Networking Applications
Susheela Narasimhan, Herman Chu, Juniper Networks
Susheela Narasimhan, Juniper Networks
IoT for the Future Data Center STACKED DIE ENABLEMENT
Seattle 11:15am – 12:45pm Designing and Reliability for IoT Devices
Lin Nease, Hewlett Packard Enterprise
Krishna Darbha, Microsoft
Stacked Die Enablement
PACKAGING ROADMAP
Seattle 9:30am - 11:00am Michael Su, AMD DATA SENSING, COMMUNICATION AND AUTONOMOUSNESS
Advances in Stacked Die Enablement FOR IOT
Grand Ballroom E 2:15pm – 3:45pm
Packaging the Brain - for Autonomous Things Edward Acquah, Amkor
Atul Hatalkar, Intel Simulation Tools for IoT Packaging Magnetic Sensors for IoT Applications

Next Generation Packaging to Address IoT Ming Yao, ANSYS Tien-Kang Chung, National Chiao Tung University

Bill Bottoms, Third Millennium Test Solutions Network Communications for Sensed IoT Data
Mechanical Behavior of Nanoparticle Filled Epoxies Li-Chun Wang, National Chiao Tung University

Raymond Pearson, Lehigh University Energy Harvesting for IoT

Muhammad Hajj, Virginia Tech

Replace Paul Semenza with Jason Marsh, NextFlex

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