Page 18 - ASME ISPS 2016 Program
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IoT Technical Session                                                                   TUESDAY, JUNE 21






               KEYNOTE ADDRESS                                         COFFEE NETWORKING BREAK                                            KEYNOTE ADDRESS
               Grand Ballroom BCD                      8:00am – 9:15am  Grand Ballroom Foyer                  11:00am – 11:15am           Grand Ballroom BCD                     12:45pm – 2:15pm



               Translating IoT Into Innovation at Every Level.                                                                            A Public-Private Research Proposal in Response to the Semiconductor
                                                                                                                                          Industry Challenges - SRC Taking the Lead
               Prith Banerjee, Schneider Electric                      DATA CENTER 2
                                                                       Grand Ballroom E                       11:15am – 12:45pm           Ken Hansen, Semiconductor Research Corporation (SRC)
               For more information see page 12
                                                                                                                                          For more information see page 12
                                                                       Data Center: Backbone for the Internet of Things
               DATA CENTER 1
               Grand Ballroom E                        9:30am – 11:00am  Mani Prakash, Intel Corp                                         RELIABILITY AND AVAILABILITY FROM PACKAGING POV
                                                                       A TCO-Based Design Approach For Evaluating IOT Data Center         Seattle                                 2:15pm – 3:45pm
                                                                       Efficiency Technologies
               Energy Efficiency Optimization in Data Centers as We Gear Up for IOT
               and Other Major Data Centers Growth Drivers             Ali Heydari, Baidu                                                 Can Either Physics of Failure or Big Data Provide a Silver Bullet to
                                                                                                                                          Improve the Availability of Complex Electronic Systems?
               Bahgat Sammakia, Kanad Ghose, SUNY Binghampton          Enabling IoT Growth Through Energy Efficient Data Centers
                                                                                                                                          Abhijit Dasgupta, University of Maryland
               IoT Centric Data Center - Challenges, Risks and Options for the Future  Yogendra Joshi, Georgia Tech
                                                                                                                                          Packaging Solutions for Networking Applications
               Susheela Narasimhan, Herman Chu, Juniper Networks
                                                                                                                                          Susheela Narasimhan, Juniper Networks
               IoT for the Future Data Center                          STACKED DIE ENABLEMENT
                                                                       Seattle                                11:15am – 12:45pm           Designing and Reliability for IoT Devices
               Lin Nease, Hewlett Packard Enterprise
                                                                                                                                          Krishna Darbha, Microsoft
                                                                       Stacked Die Enablement
               PACKAGING ROADMAP
               Seattle                                 9:30am - 11:00am  Michael Su, AMD                                                  DATA SENSING, COMMUNICATION AND AUTONOMOUSNESS
                                                                       Advances in Stacked Die Enablement                                 FOR IOT
                                                                                                                                          Grand Ballroom E                        2:15pm – 3:45pm
               Packaging the Brain - for Autonomous Things             Edward Acquah, Amkor
               Atul Hatalkar, Intel                                    Simulation Tools for IoT Packaging                                 Magnetic Sensors for IoT Applications

               Next Generation Packaging to Address IoT                Ming Yao, ANSYS                                                    Tien-Kang Chung, National Chiao Tung University

               Bill Bottoms, Third Millennium Test Solutions                                                                              Network Communications for Sensed IoT Data
               Mechanical Behavior of Nanoparticle Filled Epoxies                                                                         Li-Chun Wang, National Chiao Tung University

               Raymond Pearson, Lehigh University                                                                                         Energy Harvesting for IoT

                                                                                                                                          Muhammad Hajj, Virginia Tech










 Replace Paul Semenza with Jason Marsh, NextFlex



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          ISPS/IOT/IPW Program-june16r4.indd   18                                                                        6/9/16   2:08 PM
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