Page 18 - ASME SHTC 2017 Program

Technical Sessions Monday

Molecular Dynamics Study on Thermal Resistance between Power Partitioning and Efficiency of Piezoelectric Fan Cooling
Amorphous Silica Nanoparticles
Technical Presentation. HT2017-4742
Technical Paper Publication. HT2017-4894
Navid Dehdari Ebrahimi, Yide Wang, Y. Sungtaek Ju, UCLA, Los Angeles,
Fanhe Meng, Jin Liu, Robert Richards, Washington State University, CA, United States
Pullman, WA, United States

Transport Investigation and Phonon Engineering of Organic-Inorganic Investigation of the Thermal Behaviour of Thin Phase Change Material
Interfaces Packages as a Solution to Temperature Control in Electronics
Technical Presentation. HT2017-5033 Technical Paper Publication. HT2017-4801
Nicolas Rongione, Huu Nguyen, Huan Wu, Joon Sang Kang, Man Li, Benjamin Sponagle, Simon Maranda, Dominic Groulx, Dalhousie
Hongyan Xia, Yongjie Hu, University of California, Los Angeles (UCLA), University, Halifax, NS, Canada
Los Angeles, CA, United States
Material Distribution Optimization in a Metal Matrix Heat Sink Using
Control of Thermal Transport in Graphene and Graphene Nanomesh Construal Design Inspired Unit T-Cell Approach
Heterostructures Technical Paper Publication. HT2017-4950
Technical Presentation. HT2017-5137 Jacob Kephart, US Navy, Philadelphia, PA, United States, Gerard Jones,
Ali Yousefzadi Nobakht, Seungha Shin, University of Tennessee, Villanova University, Villanova, PA, United States
Knoxville, Knoxville, TN, United States
Temperature Measurement of Microscale Electronic Devices with 3D
Heat Transfer in Electronic Equipment Thermoreflectance Imaging
Track Organizer: Amanie Abdelmessih, California Baptist University, Technical Paper Publication. HT2017-4954
Diamond Bar, CA, United States Hongjie Zhang, Sy-bor Wen, Texas A&M University, College Station, TX,
United States

HEAT TRANSFER IN ELECTRONIC EQUIPMENT INCLUDING MOBILE Heat Transfer Equipment
DEVICES, DATA CENTERS, LEDS, PHOTONICS ETC.
Track Organizer: Sandra Boetcher, Embry Riddle Aeronautical University,
10-1-1 HEAT TRANSFER IN ELECTRONIC EQUIPMENT INCLUDING Daytona Beach, FL, United States

MOBILE DEVICES Track Co-Organizer: Gongnan Xie, Northwestern Polytechnical University,
Xi’an, China
REGENCY BALLROOM C, SECOND FLOOR 8:30AM - 10:10AM

Session Chair: Yoon Jo Kim, Washington State University Vancouver, MULTIIPHASE MULTISCALE HEAT TRANSFER IN EQUIPMENT
Vancouver, WA, United States
Session Co-Chair: Jeff Darabi, Southern Illinois University Edwardsville, 16-1-1 MULTIPHASE MULTISCALE HEAT TRANSFER IN
Edwardsville, IL, United States
EQUIPMENT
Numerical Evaluation of Clearance Requirements around
Obstructions in Finned Heat Sinks REGENCY BALLROOM F, SECOND FLOOR 8:30AM - 10:10AM
Technical Paper Publication. HT2017-4715
Steven Miner, United States Naval Academy, Annapolis, MD, United Session Chair: Zhiguo Qu, Xi’an Jiaotong University, Xi’an, Shaanxi, China
18 States
Session Co-Chair: Zuankai Wang, City University of Hong Kong, Hong
Kong, China