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TRACK HEAT TRANSFER AND THERMAL ENGINEERING – WEDNESDAY, NOVEMBER

9-29 K9-6 NANOSCALE MODELING AND
SIMULATION

9-29-2 K9-6 Nanoscale Modeling and Simulation – II

Convention Center, 250A 4:00PM–5:45PM

Session Organizer: Yan Wang, University of Nevada, Reno,
Reno, NV, United States

Session Co-Organizers: Brian D. Iverson, Brigham Young
University, Provo, UT, United States, Tianli Feng, Oak Ridge
National Laboratory, Oak Ridge, TN, United States

4:00pm – Impact of Beta-Ga2O3/Al2O3 Lattice Mismatch on
Interface Structure and Thermal Transport
Technical Presentation. IMECE2019-13448
Jinchen Han, Henry Aller, Alan McGaughey, Carnegie Mellon
University, Pittsburgh, PA, United States

4:21pm – Thermal Transport in Crystalline Si With
Vacancies and Amorphous Si
Technical Presentation. IMECE2019-13625
Amirreza Hashemi, Hasan Babaei, Ruiqiang Guo, Sangyeop
Lee, University of Pittsburgh, Pittsburgh, PA, United States

4:42pm – Mie Scattering of Phonons by Point Defects in
IV-VI Semiconductors GeTe and PbTe
Technical Presentation. IMECE2019-13641
Ruiqiang Guo, Sangyeop Lee, University of Pittsburgh,
Pittsburgh, PA, United States

5:03pm – Predicting Thermal Conductivity of Silicon in
Different Phases Using a Neural Network Interatomic
Potential
Technical Presentation. IMECE2019-13650
Ruiyang Li, Eungkyu Lee, Tengfei Luo, University of Notre
Dame, Notre Dame, IN, United States

5:24pm – Engineering Heat Transport in Nanoparticle-in-
Alloy Composites: The Role of Mie Scattering
Technical Presentation. IMECE2019-13709
Joseph Feser, University of Delaware, Newark, DE, United
States

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