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high-quality 8-inch wafers. Likewise, for device suppliers, high- quality 8-inch device manufacturing is the next crucial chal- lenge. Leading device manufacturers have acquired wafering technology or have accelerated internal development of such capabilities. In addition to signing long-term agreements with leading wafer and SiC crystal suppliers over the last few years, STMicroelectronics, Infineon, and onsemi are developing inter- nal substrate production to reduce their dependence on external suppliers and increase their margins.
Another key area of development is the module business. High voltages and high-power operations necessitate reliable and innovative module technology to get the best out of SiC. In this context, the SiC supply chain is undergoing a significant change, with strategic partnerships being struck between the leading device manufacturers and Tier 1 suppliers. In recent years, Wolfspeed partnered with StarPower, ABB, ZF, and Delphi for SiC-based powertrain systems, while Rohm teamed up with Vitesco and Leadrive Technologies to develop SiC pow- ertrain solutions. Automotive Tier 1 player Bosch is also inter- nally developing SiC modules.
In a nutshell, the SiC transition in the power electronics indus- try is happening now. The industry expects this decade to be the decade for SiC, as cars with “SiC inside” hit the road.
Fasten your seat belts and enjoy the journey.
Ezgi Dogmus
is team lead analyst for the compound semiconductor and emerging substrates activity within the Power & Wireless Division at Yole Développement (Yole).
Ana Villamor
is a technology and market analyst for power electronics and compound semiconductors within the Power & Wireless Division at Yole.
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Market Overview Power SiC in the EV Era: Fasten Your Seat Belts