Page 73 - PCMI Journal December 2020

General Overview of PCM Equipment - Wet Processing Presented by: Mike Soble, Technical Sales Manager, Chemcut Corporation, US 11/23/20
35
BASIC ETCH:
The Key Parameters for BASIC ETCH machines are:
Ø BATH MANAGEMENT:
• Ferric Chloride Etch systems can be operated as a batch process. Consistent chemistry replacement
at the specified time or based on the number of panels processed is necessary to manage the Ferric bath. When operating a batch FERRIC ETCH machine, the etch rate will slow down as the bath etches and loads with metal. Eventually, the etch rate will slow to a degree that requires bath replacement.
• AUTO BAUME CONTROL: Maintains the specific gravity of the etchant by adding water as needed.
• ORP PROBE: An ORP probe, (Oxygen Reduction Potential or REDOX), is a valuable option to add to BASIC ETCH machines. In a ferric chloride etch bath, an ORP probe provides an indication of the ratio of ferric chloride, (fe3+), to ferrous chloride, (fe2+). This ratio effects the etch rate.
Simply stated, the higher the ORP, the faster the etch rate.
• REGENERATION, (REGEN), can be added to these BASIC ETCH machine
o More Information on Regeneration will be provided when we discuss HIGH END ETCH
Chemcut
MEDIUM ETCH:
The MEDIUM or AVERAGE type of equipment used for ETCHING is the Chemcut XLi product offering. The XLi machine features modular construction that allows for flexible configuration to meet a customer’s production goals and allows for future expansion.
ETCHING line:
ØStation1: LOAD
ØStation2: ETCH
Ø Station 3: RINSE 1, (Recirculated)
Ø Station 4: RINSE 2, (Fresh)
Ø Station 6: DRY, (optional) ØStation7: UNLOAD/CONVEYORDRIVE
Chemcut
36
Issue 136 December 2020 PCMI Journal 73
18