Page 18 - TNT_placeholder
P. 18

Rhodium Electroplating Systems

               Rhodium is a platinum group metal with a good white colour and is hard and tarnish
               resistant. For jewellery purposes, we desire a bright deposit, defect-free and hard and
               there are several suitable rhodium plating systems on the market. These are sulphate
               type baths and are very acidic.
               Usually, deposit thickness of about 0.5 microns, but up to 2-3 microns, is plated on gold
               jewellery to give the required surface characteristics. There is  a tendency for internal
               stress to build up in the deposit as thickness increases, resulting in cracking eventually.
               For the high carat golds, a thicker layer of rhodium is plated directly on the substrate, but
               for low carat golds, a nickel interlayer is plated first, allowing a thinner, cheaper rhodium
               deposit without losing colour and providing good corrosion resistance.
               As with gold, good surface preparation is required to provide a clean surface for quality
               electroplating. The following practice is recommended:
                      Electrolytic cleaning
                      Rinse in demineralised water
                      Check surface wettability (no formation of droplets)
                      Dip piece in aqueous solution of sodium cyanide (35 g/l)
                      Rinse in running water or demineralised water
                      Dip in electrolyte with power on (do not touch) & electroplate
                      Rinse and dry.
               Plating should take from 30 seconds to 2 minutes, depending on thickness desired. Inert
               anodes of platinum are used at 4-5 cm distance with a surface area at least as big as the
               cathode. The bath should be well agitated or stirred.
               Periodic replenishment  of  the  rhodium  in  the  bath  is  necessary  and this is  done  with
               special rhodium replenishment solutions which have a high rhodium concentration and
               low acidity. It is important to avoid contamination of the electrolyte by other metals, so
               good rinsing and use of non-metallic tanks is recommended.
               A typical rhodium electroplating system has the characteristics shown in Table 3.
               The extremely high hardness of the deposit is notable. This is an advantage in rhodium
               plating master models in silver for investment casting and electroforming as it enables a
               high degree of polish to be obtained on the model, with benefit down the line to the casting
               or electroform.
               Electrolyte additives such as magnesium sulphate, selenic acid and sulphites are often
               used to control internal stress build-up.
                              Rhodium content                             1.5 – 2.5 g/l
                              Bath temperature                            40 – 50°C
                              pH                                          < 1
                              Plating rate                                2 mg/A/min
                              Current density                             1.5 – 5.0 A/dm2
                              Salts/acids                                 Sulphuric acid
                              Deposit purity, rhodium %                   99.9
                              Time to deposit 1 micron                    30 secs.
                              Deposit appearance                          Bright
                              Hardness of deposit                         HV 950
                                 Table 3 – Typical bright rhodium electroplating system
   13   14   15   16   17   18   19   20   21   22