Page 16 - TTS Product Sheet 2023
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Kappa Series PoP Contactors
Highly configurable test solution for stacked devices.
Mobility IoT Wearables Gaming SoC
Package on Package (PoP) semiconductor devices rely on a packaging technology where one or more
semiconductor packages such as memory and logic processors are vertically stacked into a single device.
This enables the creation of smaller electronic devices, with improved performance and functionality in a
smaller footprint. As PoP technology gains popularity in the semiconductor industry, the need for reliable
testing solutions becomes more critical. Kappa Series PoP Contactors from TTS offer a robust contactor
design that combines the proven performance of TTS's high reliability spring probes with state-of-the-art
manufacturing technology for accurate pin to pad contact. With multiple configurations available for testing
various components at each stage of package assembly and validation, TTS PoP test contactors ensure
that all components of the device are fully functional and meet the required specifications. TTS Kappa
Series PoP Contactors are highly precise, reliable, and adaptable to different sizes and device
configurations, making them a valuable tool for semiconductor manufacturers looking to optimize their
testing processes. With Kappa Series PoP Contactors, you can be confident that your PoP devices are
thoroughly tested and ready for market.
Key features
Matched pin lengths for a variety of package thicknesses
Multiple device test configurations with integrated PCB
Robust probe design for long life and reduced maintenance
Compatible with most Automated Test (ATE) handler platforms
Tri-temp testing between -40 to 125°C
Pitch 0.4mm and greater
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