Page 19 - JuneA-ZScholar Listing2021scopus

Mitigating early fracture of amorphous metallic thin films on flexible substrates by tuning
substrate roughness and buffer layer properties
WC Hai T. Tran, T Do (2019)
Thin Solid Films 137493, cited by 2 (1.00 per year)

Cuong Do - Assistant Professor, College of

Engineering and Computer Science VinUniversity;
University of Cambridge

Profile ID: _NdIi4AAAAAJ
Profile labels: Analog Electronics, CMOS IC, Embedded Sensors MEMS
ORCID: 0000-0003-4785-4524

Metrics
Publication years: 2007-2021
Citation years: 14 (2007-2021)
Papers: 37
Citations: 378
Citations/year: 27.00 (acc1=18, acc2=11, acc5=4, acc10=2, acc20=0)
Citations/paper: 10.22
Authors/paper: 3.59/3.0/3 (mean/median/mode)
Age-weighted citation rate: 77.25 (sqrt=8.79), 21.45/author
Hirsch h-index: 11 (a=3.12, m=0.79, 287 cites=75.9% coverage)
Egghe g-index: 18 (g/h=1.64, 347 cites=91.8% coverage)
PoP hI,norm: 5
PoP hI,annual: 0.36
Fassin hA-index: 4
Year New Total citations
2019 63 292
2020 57 349
2021 29 378

Publications

Active Temperature compensation for MEMS capacitive sensor
C Do, AA Seshia (2021)
TechRxiv