Page 429 - Programmable Logic Controllers, Fifth Edition - Mobile version

Hardware (continued)
modular, 4–5, 6f
memory types, 37–38, 38f fixed, 4, 5f points per module, 34
short circuit protection, 34
motion and position control modules, 32, 32f PC interface card, 21f Isolation transformers, 287
PID module, 32, 32f plug-in terminal block, 22, 22f
programming terminal device, 39, 39f rack-based, 18, 18f J
special I/O modules, 31–32 remote I/O rack, 18, 18f
stepper-motor module, 32, 32f wiring connections, 9, 9f Jog circuit with control relay, 123–124f
thumbwheel module, 31, 31f Input protection, analog I/O modules, 34 Jump (JMP) instruction, 188–190, 188–190f
TTL module, 31 Input threshold voltages, discrete I/O modules, 33 Jump to subroutine (JSR) output instruction, 191
Hardwired logic Input troubleshooting guide, 298f
defined, 67 Inrush current, discrete I/O modules, 34 K
vs. programmed logic, 67–68 Instantaneous contacts, 132 Keyboards, 91
Hardwired time-delay circuit, 221 Instruction addressing, 86–87, 86f Keyswitch, three-position, 93f
Hardwired TOF relay circuit, 142–143, 142f Instruction list (IL) programming language, 81 1-K word memory, 48, 48f
equivalent PLC program, 143–144, 143f vs. ladder diagram programming, 81–82, 81f
HART, 328, 328f Instruction palette, 92 L
Heating application, proportional band for, 312, 312f Instructions. see also Program control instructions;
Heat-shrinkable wire identification sleeves, 285f Sequencer instructions Label (LBL) instruction, 188–189
Hexadecimal (hex) numbering system, 47t, 50–51, 51t counter, 157–158 Ladder diagram (LD) language, 81
conversion to binary number, 51, 51f override, 185 advantages, 92–93
conversion to decimal number, 51, 51f timer, 134–135, 134–135f entering program, 91–93
numeric values, 52t block format, 135, 135f Data File screens, 92, 92f
High-density module, 22 coil-formatted, 134–135, 135f instruction toolbar with bit, 91f
High-speed counter (HSC), 160, 177–178, 178f off-delay timer, 140–144, 141–143f I/O Configuration screen, 92, 92f
High-speed counter module, 31, 31f on-delay timer, 135–138f, 135–140 main window, 91–92, 91f
High-speed counting, 4f Instruction set, 14, 14t Select Processor Type screen, 92, 92f
HMIs. see Human machine interfaces (HMIs) Instruction toolbar with bit, RSLogix 500 software, 91f function block diagram and, 82, 82f
Holding circuits, 114–115, 114–115f Instrumentation, 127 function of, 85–86, 85f
Hold-up time, 35 Instrument(s), 127 vs. instruction list programming, 81–82, 81f
Horizontal scan, 81, 81f calibration, 127 Ladder logic contacts
Human machine interfaces (HMIs), 12, 12f, 39–42, 40f, smart, 127, 127f function block diagram equivalents to, 82f
308–309, 308f Intact, data, 211, 212f Ladder logic program, 7, 9–10, 9f, 67–68, 67f
alarms, 41, 41f Integer file, 75 CLX system, 346, 346f
Allen-Bradley Pico GFX-70 controller, 40f Integral action, proportional control and, 312 addition to main routine, 348–350, 348–350f
design, 40 Internal bits, 89 diagram for modified process, 11f
event history, 41 Internal coils, 89 drilling process (example), 124–126, 124–126f
graphics library, 42, 42f Internal control relays, 89 electrical continuity in, 79
graphic terminals, 309 Internal outputs, 89 monitoring, 93, 93f
monitor and enclosure, 41, 41f Internal relay instructions, 89, 89f, 90f parallel instructions, 122–123, 123f
structure, 40, 40f CLX system, 350–352, 351–352f relay schematics conversion to, 121–123
tasks, 40–41 Internal storage bits, 89 rung conditions, evaluating, 79, 79f
trend, 41–42, 42f Inverter, 64 for sequential control process, 122, 123f
Hunting, 311 I/O address format series instructions, 122, 123f
Hysteresis, 105–106 for SLC family of PLCs, 75–76, 77f troubleshooting, 294–299, 295–296f
I/O bus networks, 319 writing, from narrative description, 124–126, 124–126f
I/O Configuration screen, RSLogix 500 software, 92, 92f Ladder rung, 85–86, 85f
I I/O connection diagram, 87f Ladder window, 92
IEC 61131 standard Sequential control process, 122, 122f properties, 92
programming language, 81, 81f I/O count, 12–13 Language, 7, 67, 81–83, 81f
IEEE 754 Standard, 58 I/O modules function block diagram programming, 81, 82, 82f
Immediate input with mask (IIM) instruction, analog, 27–29f, 27–31 IEC 61131 standard, 81, 81f
193–194, 194f BASIC or ASCII module, 31 instruction list programming language, 81–82, 81f
Immediate I/O instructions, 193–194, 194f BCD-output module, 32, 32f ladder diagram language, 81, 82, 82f
Immediate output with mask (IOM) instruction, communication modules, 32, 33f sequential function chart (SFC) programming language,
193, 194, 194f discrete, 22–27, 23–25f, 24t 81, 82, 82f
Incremental encoder-counter applications, 173–174, 174f encoder-counter module, 31, 31f structured text (ST), 81, 83, 83f
Incremental mode, FAL instruction, 213 high-speed counter module, 31, 31f Last In, First Out (LIFO) instruction, 275
Incremental optical encoder, 173–174, 174f motion and position control modules, 32, 32f example, 275, 275f
Increment counter, 158 PID module, 32, 32f vs. FIFO stack operation, 275, 275f
Individual control, 306, 307f special, 31–32 Latch coil, 116–117
Inductive loads, noise suppression for, 284, 284f stepper-motor module, 32, 32f Latching relays, 116–120, 117–120f
Inductive proximity sensors, 105, 105f thumbwheel module, 31, 31f Latch instructions, CLX system, 352–353, 352–353f
Inductive proximity switches, 106–107 TTL module, 31 Leakage current, 285
Industrial networks I/O specifications discrete I/O modules, 34
control level, 318 analog I/O module, 34–35 Least significant bit (LSB), 48
device level, 318 channels per module, 34 Length, FAL instruction, 212
functionality levels, 318, 318f common-mode rejection, 34–35 Less Than (LES) instruction, 217, 218, 218f
information level, 318 input current/voltage range(s), 34 Less Than or Equal (LEQ) instruction, 217, 218, 218f
Input branching, 87, 87f input impedance and capacitance, 34 Level switches, 104, 104f
nested, 87–88, 87f input protection, 34 LIFO (last in, first out) instruction, 275
Input current/voltage range(s), analog I/O modules, 34 output current/voltage range(s), 34 example, 275, 275f
Input devices, 6–7 resolution, 34 vs. FIFO stack operation, 275, 275f
and outputs, relationships between, 2, 3f discrete I/O module, 33–34 Light-emitting diode (LED) window, 39
Input file, 75 ambient temperature rating, 33 Light sensors, 107–109, 107–109f
Input image table file, 76–77, 77f backplane current draw, 34 bar code scanners, 108–109, 109f
Input impedance and capacitance, analog I/O electrical isolation, 34 fiber optic, 108, 109f
modules, 34 input on/off delay, 33 photoconductive cell, 107, 107f
Input instructions, 216. See also Data comparison input threshold voltages, 33 photoelectric, 107–108, 108f
Input malfunctions, troubleshooting, 292–293, 293f inrush current, 34 photovoltaic/solar cell, 107, 107f
Input on/off delay, discrete I/O modules, 33 leakage current, 34 scan technique, 108, 108f
Input/output (I/O) section, 4, 6–7, 7f, 18–22, 18f nominal current per input, 33 LIM. See Limit test (LIM) instruction
addressing, 18–21, 19f, 20f nominal input voltage, 33 Limit switch, 103, 103f
combination I/O modules, 21–22, 21f output current, 33 Limit test (LIM) instruction, 217, 218–220, 219f, 220f
field/real-world devices, 7 output voltage, 33 Liquid-crystal display (LCD) windows, 39
410 Index

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