Page 70 - ASME INTERPACK 2018 Program
P. 70
2018 InterPACK Conference Leadership
TRACK 4: GEN3 EMBEDDED COOLING FOR WIDE BANDGAP POWER AMPLIFIERS
Damena Agonafer, Lauren M. Boteler, Sukwon Choi, Patrick McCluskey,
Washington University in St. Louis US. Army Research Laboratory Pennsylvania State University University of Maryland
TRACK 5: AUTONOMOUS, HYBRID, & ELECTRIC VEHICLES
Przemyslaw Gromala, Pradeep Lall, Sven Rzepka, Azeem Sarwar,
Robert Bosch GmbH Auburn University Fraunhofer ENAS General Motors
Milena Vujosevic,
TDK-Sensor Systems Business
Company
TRACK 6: INDUSTRY, NATIONAL LAB, ACADEMIA POSTERS
Nazli Donmezer, Joshua Gess, Kyle R. Gluesenkamp, Jin Yang,
Middle East Technical University Oregon State University Oak Ridge National Laboratory Intel Corporation
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