Page 78 - ASME INTERPACK 2018 Program

ASME/EPPD Leadership and Personnel

ELECTRONIC & PHOTONIC PACKAGING DIVISION LEADERSHIP DESIGN MATERIALS AND MANUFACTURING SEGMENT LEADERSHIP

Chair Mehdi Asheghi, Stanford Chair Tim Simpson, Penn
` University State

Vice-Chair Milena Vujosevic, Intel TEC Rep Gloria Wiens, University of
Florida
Past-Chair Kaustubh Nagarkar, GE

Treasurer Amy Fleischer, Villanova Member Andrew Alleyne, University of
University Illinois

Secretary Kaushik Mysore, AMD Member Stephen Reese, Idaho National
Laboratory

Member Larry Dickinson, 3F LLC

2018 INTERPACK CONFERENCE LEADERSHIP Member Abhijit Dasgupta, University of
Maryland
General Chair Kaustubh Nagarkar, General
Electric
Member Y. F. Pang, Intel

Vice General Chair Xiaobing Luo, Huazhong Member K. Subramanian, Virginia Tech
University of Science and
Technology Member Dean Bartles, University of New
Hampshire
Program Chair Samuel Graham, Georgia Institute
of Technology
ASME Staff Raj Manchanda

Program Co-Chair Sreekant Narumanchi, National ASME Staff Mary Jakubowski, CMP
Renewable Energy Laboratory

Logistics Chair Yoonjin Won, University of 2018-2019 ASME OFFICERS
California, Irvine President
Past President
Communications & Website Chair Douglas DeVoto, National President-Nominee/Elect Said Jahanmir
Renewable Energy Laboratory Executive Director Charla C. Wise
Richard Laudenat
Awards Coordination Chair Jin Yang, Intel Corporation Thomas Costabile

Sponsorship Committee Mehdi Asheghi, Stanford
University

Ravi Mahajan, Intel Corporation

Yogendra Joshi, Georgia Institute
of Technology

Past General Chair Mehdi Asheghi, Stanford
University

Past Vice General Chair Ravi Mahajan, Intel Corporation

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