Page 17 - ASME_AM3DIDETC_2016_Program

Welcome Letters

IDETC/CIE

36TH COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE (CIE)

The Computers and Information in Engineering Division of ASME wel- • CAPPD Emotional Engineering (2 sessions)
comes all IDETC/CIE Conference participants to the 36th Annual Comput- • CAPPD: Human-Centric Design
ers and Information in Engineering Conference (CIE). This conference is a
• CAPPD/AMS: Human Modeling: Methods and Applications in
premier formal for international exchange of technical, scientific, and
Engineering (2 sessions)
application knowledge related to the theory and practice of computing to
support engineering activities. As such, this broad conference is organized • CAPPD Feature-Based Modeling and Assembly
around the four Technical Committees of the CIE Division: • CAPPD: Geometric Simulations and Part Modeling
• Advanced Modeling and Simulation (AMS) • Design for Resilience and Failure Recovery (with Design
• Mahesh Mani, Chair (mahesh.mani@nist.gov) Automation Conference)
• Seung Ki Moon, Vice Chair (skmoon@ntu.edu.sg) • SEIKM Design Informatics
• Computer Aided Product and Process Design (CAPPD) • SEIKM: Knowledge Capture, Reuse, and Management (2 sessions)
• Rahul Rai, Chair (rahulrai@buffalo.edu) • SEIKM Systems Engineering
• Chi Zhou, Vice Chair (chizhou@buffalo.edu) • VES: General Technology for Augmented, Virtual, and Mixed
Reality
• Systems Engineering and Information Knowledge Management
(SEIKM) • VES: Interaction and Interfaces
• Christopher Hoyle, Chair, (chris.hoyle@oregonstate.edu) • VES: Game Ecosystems in Engineering
• Ashis Banerjee, Vice Chair, (ashisb@uw.edu)
• Virtual Environments and Systems (VES) Additionally, we have organized four panels of leading experts in their
respective fields to provide discussions and forums for current topics of
• Francesco Ferrise, Chair, (francesco.ferrise@polimi.it)
relevance:
• Robert Wendrich, Vice Chair, (info@rawshaping.com)
• VES Panel: 2020: A Virtual Exploration in Real Usefulness
• AMS Panel: Smart Manufacturing: Industrial Internet of Things
This conference provides a forum for researchers, practitioners, educators,
• CAPPD Panel: Creating Multisensory Experience
and students from industry, academe, and government research labs to
share their latest findings and challenges with the broader research • SEIKM Panel: The Internet of Things and Its Impact on Driver
community, foster collaborations, and build a sustainable research Safety and Wellness
community.
We are also delighted to offer an Industry Presentation session entitled,
The conference organizing team is pleased to report that there are 130 Computer and Information Technology Trends, as well as a poster session
accepted papers from 161 submitted full papers. The papers have been for graduate students to afford them the opportunity to present their
organized into 21 symposiums consisting of the following 29 total sessions: current work to the research community and get feedback.
• Advanced Modeling and Simulation (AMS) General (2 sessions)
• Computer-Aided Product and Process Development (CAPPD) We are pleased to offer the CIE keynote in collaboration with AM3D
General keynote on Monday, 12–2 pm. The audience will have the pleasure of
enjoying two excellent keynote speakers with plenty of time for Q&A and
• Virtual Environments and System (VES) General
discussion during this time slot.
• Systems Engineering, Information, and Knowledge Management
(SEIKM) General
We would like to thank all the authors for submitting papers to share their
• AMS Inverse Problems in Science and Engineering
work. We would like to thank the reviewers for providing valuable
• AMS: Simulation in Advanced Manufacturing feedback to help improve the reporting and the quality of the conference,
• AMS Uncertainty Quantification in Simulation and Model and the session chairs and co-chairs that worked on coordinating the
Verification & Validation (2 sessions) paper review process. It is impressive to note that well over 400 reviews
• AMS: Computational Multiphysics Applications were submitted this year.
• AMS Design, Simulation and Optimization for Additive Manufac-
turing (4 sessions) On Tuesday afternoon, we will hold our annual awards luncheon at which 17