Page 127 - ASME InterPACK 2017 Program

CALL FOR ABSTRACTS (DUE DECEMBER 1, 2017)

International Technical Conference and Exhibition on
Packaging and Integration of Electronic and Photonic

Microsystems

AUGUST 28-31, 2018 AT SANTA CLARA, CALIFORNIA, USA

http://www.asme.org/events/interpack

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufactur-
ing, and applications of electronics packaging and heterogenous integration. It is the flagship conference of the ASME Electronic
and Photonic Packaging Division (EPPD). The international nature of the meeting has been highly beneficial in promoting global
interactions between Industry and Academia. In addition to paper presentations and exhibits, InterPACK 2017 will include panel
discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a Joint Industry-Academia poster
session. Original papers are solicited in the general track areas of (but not limited to):

HETEROGENEOUS INTEGRATION: POWER CONVERSION & STORAGE:

Advanced Packaging, Die Stacking, Multichip Modules, Intercon- Wide Bandgap Semiconductor Packaging, Power Electronics,
nect Technology, Substrate Technology, Through-Silicon Vias Energy Harvesting, Energy Storage, Nanoscale Heat Transport,
(TSV), Wafer Level Packaging (Fan-in, Fan-out), Panel Level 2D Materials, Graphene & CNT Materials and Devices, Novel
Packaging, System in Package (SiP), Microsystems Integration, Interconnects, Harsh Environment Sensors, Thermoelectrics,
Integrated Photonics, Internet of Things, Edge Computing, RF Photovoltaics, High Temperature Electronics for Oil & Gas and
Packaging, Advanced Materials and Processes, Chip Package Geothermal Energy. Fracture, Fatigue, and Delamination of
Interaction, Modeling, Characterization and Reliability for Interfaces and Interconnects, Thermomechanical Stress and
Integrated Devices, Electronic Materials, Underfills, Molding Device Reliability.
Compounds, Substrates, Thermal Materials, Dielectrics.
TRANSPORTATION, AUTONOMOUS,
SERVERS OF THE FUTURE: & ELECTRIC VEHICLES:

Data Centers & Energy Efficient Electronic Systems, Cloud Electronics for Vehicle Electrification, High Temperature
Computing Hardware, Rack Level Cooling, Thermal Interface Sensors, RADAR, LIDAR, Advanced Driver Assistance System
Materials & Thermal Underfills, Fans & Pumps, Thermosyphons & (ADAS) Electronics, MEMS packaging, Control Systems, Elec-
Refrigeration, Exaflop Computing Systems, Memory, Connectors, tronic Materials, Nanosatellites, Unmanned Aerial Vehicle (UAV)
Advanced Substrates, Novel Cooling Techniques, Heat Ex- Electronics, Hybrid Packaging, Prognostic Health Monitoring,
changers, Device to System Level Packaging, Nanoscale Heat Vehicle Charging, Wireless Power Transfer, Energy Conversion,
Transport. Electric Drive Technologies e.g. Electric Machines, Motor Control
Sensing, and Battery Management.
STRUCTURAL AND PHYSICAL HEALTH
MONITORING: TENTATIVE PUBLICATION SCHEDULE:

Wearables, Asset Monitoring, Implantable Medical Devices, Abstract Submission: December 1, 2017
Microfluidics, Interconnects, Substrate Materials, Printed Draft Paper Submission: February 16, 2018
Electronics, Thin Die Handling, Non-Contact Processes. Sensors Draft Paper Acceptance Notification: March 30, 2018
& Actuators, RF Resonators, Microfluidics, Fabrication, Integra- Submission of Revise Draft Papers: April 20, 2018
tion, Hermetic Packaging, & Reliability, Biosystems & Biomedi- Submission of Copyright: May 11, 2018
cine, and Industry Perspectives. Reliability of devices, Intercon- Submission of Final Paper: May 18, 2018
nects, Solder Joint Reliability, Materials Interactions, Chemical,
Biological, and Physical Implications, System Level Reliability DIRECT GENERAL INQUIRIES TO:
Issues, Materials characterization, Reliability Modelling and Kaustubh Nagarkar (nagarkar@ge.com): General Chair
Simulation, Reliability Test Methods, Prognostics and Health Xiaobing Luo (luoxb@hust.edu.cn): General Chair - China
Monitoring. Sam Graham (sgraham@gatech.edu): Program Chair
Sreekant Narumanchi (sreekant.narumanchi@nrel.gov): Program Co-Chair

The American Society of Mechanical Engineers® 112277

ASME®