Page 51 - ASME SMASIS 2016 Program
P. 51

Technical Program


                         Mountain Birch              Tamarack E                       Tamarack D

                                 Modeling Nanocomposite Piezoresistive   Zone Material Point Method Technical Publication. SMASIS2016-9236        Christiansburg, VA, United States




                    11:40          Response with Electromechanical Cohesive   Adarsh Chaurasia, Virginia Tech, Blacksburg, VA,  United States, Gary Don Seidel, Virginia Tech,















                                 Coupled Electromechanical Peristatic  Simulation of Deformation and Damage  Sensing in Granular Materials Technical Publication. SMASIS2016-9235  Christiansburg, VA, United States  Electroelastic Bandgap Formation in  Piezoelectric Shunts: A Modal Analysis  Technical Publication. SMASIS2016-9282  of Technology, Atlanta, GA, United States  Fiber Bragg Grating Sensor Arrays Technical Publication. SMASIS2016-9204




                    11:20                 Naveen Prakash, Virginia Tech, Blacksburg, VA,  United States, Gary Don Seidel, Virginia Tech,   Locally Resonant Metamaterial Beams with   Christopher Sugino, Stephen Leadenham,  Massimo Ruzzene, Alper Erturk, Georgia Institute   Damage Detection with Guided Waves and   Xiaoyi Sun, Zhenhua Tian, Lingyu Yu, Bin Lin,  University of South Carolina, Columbia, SC, United









                         10:40AM–12:00PM             10:40AM–12:00PM   Approach        10:40AM–12:00PM         States


                                 2-Scale Hierarchical Multiscale Modeling  of Piezoresistive and Damage Response in  Polymer Nanocomposite Bonded Explosive Technical Publication. SMASIS2016-9234       Krishna Talamadupula, Adarsh Chaurasia,   United States  for Electrical Tuning of Magnetostrictive  Unimorph System Dynamics Technical Publication. SMASIS2016-9274       Universität Dresden, Dresden, Germany, Jin- Hyeong Yoo, US Army Research Laboratory,  Aberdeen, MD, United States, Alison Flatau,   States Session Organizer: Guirong





                    11:00                   Virginia Tech, Blacksburg, VA, United States, Gary  Don Seidel, Virginia Tech, Christiansburg, VA,   Equivalent Electromechanical Circuit Analysis   Maxim Germer, Uwe Marschner, Technische   University of Maryland, College Park, MD, United   Locate Damage Based on Change in Structural  Shape Calculated From Uniform Load Surface  Science and Technology, Rolla, MO, United States,  Jianxin Yu, University of Texas at El Paso, El Paso,  TX, United States, Yi Zhao, Missouri University of  Scie











                 FRIDAY, SEPTEMBER 30, 2016  10:40  2-10 Piezo Resistive Materials and Devices  Session Organizer: Lider Leon, North Carolina State University, Raleigh, NC, United States Session Co-Organizer: Gary Don Seidel, Virginia Tech, Christiansburg, VA, United States  Electromechanical Behavior and Microstructure  of Highly Sensitive Polyaniline/Ethylene Vinyl  Acetate Composite Piezoresistive Materials Technical Publication. SMASIS2016-9163       Indu Chanchal Polpaya, C. Lakshmana Rao,  Susy Varughese, Indian Institute of
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