Page 21 - ASME HT FE ICNMM 2016 Program

Heat Transfer Technical Sessions

WEDNESDAY, JULY, 13 MEASUREMENTS & COMPUTATIONS OF THERMOPHYSICAL
PROPERTIES
1-2 THERMOPHYSICAL PROPERTIES OF FLUIDS AND SOLIDS
TRACK 2 THERMOPHYSICAL PROPERTIES (K7)
Glacier 4:00pm - 5:40pm
Session Chair: Nick Roberts, Utah State University, Logan, UT, United
MEASUREMENTS & COMPUTATIONS OF THERMOPHYSICAL
PROPERTIES States
1-1 INTERFACES, FILMS AND FIBERS
Session Co-Chair: Heng Ban, Utah State University, Logan, UT, United
Glacier 2:00pm - 3:40pm States
Session Chair: Nick Roberts, Utah State University, Logan, UT, United
States
4:00pm Improving the Resolution of Steady-State, Infrared-Based
Session Co-Chair: Heng Ban, Utah State University, Logan, UT, United
States Thermal Interface Resistance Measurements Using High-Precision
Metrology to Determine In-Situ TIM Thickness
Technical Paper Publication. HT2016-7043
2:00pm Parallel Measurement of Conductive and Convective Thermal
Transport of Micro/Nanowires Based on Raman Mapping
Ronald Warzoha, Andrew N. Smith, Maurice Harris, United States Naval
Technical Presentation. HT2016-7018 Academy, Annapolis, MD, United States

Yanan Yue, Wuhan University, Wuhan, MI, China
4:20pm Thermal Conductivity of Cementitious Composites
Containing Microencapsulated Phase Change Materials
2:25pm Prediction of Thermal Boundary Conductance at the Interface
with Phonon Wave-Packet Simulations: The Roles of Vibrational Technical Presentation. HT2016-7070
Spectra Differences, Interface Bond Strength, and Inelastic Scattering
Alexander Ricklefs, Alexander Thiele, Gabe Falzone, Gaurav Sant,
Technical Paper Publication. HT2016-7177 Laurent Pilon, University of California, Los Angeles, Los Angeles, CA,
United States
ChangJin Choi, William Tanner Yorgason, Nick Roberts, Utah State
University, Logan, UT, United States
4:40pm Effect of Carbon Powder on the Fluid Properties of PAM
Solution
2:50pm Thermal Boundary Conductance across a Wide Array of
Metal/Substrate Combinations Technical Paper Publication. HT2016-7172

Technical Presentation. HT2016-7299 Meng Zhang, Hongna Zhang, Sining Li, Xiaobin Li, Fengchen Li, Harbin
Institute of Technology, Harbin, China
John Gaskins, Patrick Hopkins, University of Virginia, Charlottesville, VA,
United States, Elizabeth Paisley, Jon F. Ihlefeld, Sandia National
Laboratories, Albuquerque, NM, United States
5:00pm Thermophysical Properties of Two-Phase Refrigerant Based
Nanofluids in a Refrigeration Cycle

3:15pm Two-Step Raman Method for Interface Thermal Resistance Technical Paper Publication. HT2016-7192
and In-Plane Thermal Conductivity Characterization of Graphene
Interface Materials Bilgehan Tekin, Aselsan Inc., Ankara, Turkey, Almila Guvenc Yazicioglu,
Middle East Technical University, Ankara, Turkey
Technical Paper Publication. HT2016-7362
Man Li, Yanan Yue, Wuhan University, Wuhan, MI, China
5:20pm Numerical Study of Heat Conduction of High Porosity
Open-Cell Metal Foam/Paraffin Composite at Pore Scale

Technical Paper Publication. HT2016-7386
21
Yuanpeng Yao, Huiying Wu, Zhenyu Liu, Shanghai Jiao Tong University,
Shanghai, Shanghai, China