Page 31 - ASME HT FE ICNMM 2016 Program

Heat Transfer Technical Sessions

9:50am Wetting Characteristics of Nanograss-Coated Copper 11:45am Effects of Field Plate on Maximum Temperature and
Inverse Opals Temperature Distribution for GaN HEMT Devices

Technical Presentation. HT2016-7535 Technical Paper Publication. HT2016-7367

Quang Pham, Pranav Dubey, Kuan-Wei Chen, Kimia Montazeri, Yoonjin Dogacan Kara, Nazli Donmezer, Middle East Technical University, Ankara,
Won, University of California, Irvine, Irvine, CA, United States Turkey, Talha Furkan Canan, Ozlem Sen, NANOTAM Research Center,
Ankara, Turkey, Ekmel Ozbay, Bilkent University, Ankara, Turkey

ADVANCES IN MODELING AND SIMULATION OF NANOSCALE HEAT
CONDUCTION HARD-SOFT MATERIAL INTERFACES AND THERMAL INTERFACE
3-2 BOLTZMANN TRANSPORT EQUATION SIMULATIONS MATERIALS
4-3 HARD-SOFT MATERIAL INTERFACES AND THERMAL
Regency D 10:30am - 12:10pm
INTERFACE MATERIALS III
Session Chair: Xiulin Ruan, Purdue University, West Lafayette, IN, United
States Lexington 10:30am - 12:10pm
Session Chair: Shannon Yee, Georgia Institute of Technology, Atlanta, GA,
Session Co-Chair: Yanbao Ma, University of California, Merced, Merced, United States
CA, United States
Session Co-Chair: Xiaojia Wang, University of Minnesota, Twin Cities,
Minneapolis, MN, United States
10:30am Volume Averaged Phonon Boltzmann Transport Equation for
Heat Transport in Nanoporous Composites
10:30am Fabrication and Characterization of Copper Nanowire Arrays
Technical Presentation. HT2016-7063 as Thermal Interface Materials

Columbia Mishra, James Loy, Jayathi Murthy, The University of Texas at Technical Presentation. HT2016-7107
Austin, Austin, TX, United States, Sanjay Mathur, Amoeba Technologies,
Austin, TX, United States Wei Gong, Pengfei Li, Sheng Shen, Carnegie Mellon University,
Pittsburgh, PA, United States

10:55am Simulation of Time-Domain Thermoreflectance Experiments
Using the Multi-Dimensional Frequency-Dependent Phonon Boltzmann 10:50am Thermal Conductivity of Single and Double Silicon
Transport Equation Nanoribbons

Technical Presentation. HT2016-7078 Technical Presentation. HT2016-7245

Syed A Ali, Sandip Mazumder, Ohio State University, Columbus, OH, Lin Yang, Yang Yang, Qian Zhang, Matthew D. Gerboth, Greg Walker,
United States Deyu Li, Vanderbilt University, NASHVILLE, TN, United States

11:20am Nondiffusive Thermal Transport Increases Temperature Rise 11:10am Ultralow Thermal Conductivity of Multifunctional
in RRAM Filaments Nanotrusses
Technical Presentation. HT2016-7266 Technical Presentation. HT2016-7293

Keith Regner, Jonathan Malen, Carnegie Mellon University, Pittsburgh, Nicholas Dou, Austin Minnich, California Institute of Technology,
PA, United States Pasadena, CA, United States

11:30am Thickness and Density Effects in the Thermal Conductivity of
Amorphous Alumina Thin Films Grown via Atomic Layer Deposition

Poster Paper Presentation. HT2016-7233
Kelsey Meyer, Mallory DeCoster, John Gaskins, Patrick Hopkins, 31
University of Virginia, Charlottesville, VA, United States, Brandon Piercy,
Mark Losego, Georgia Institute of Technology, Atlanta, GA, United States