Page 43 - ASME HT FE ICNMM 2016 Program

Heat Transfer Technical Sessions

MONDAY, JULY, 11 2:00pm A Roadmap for Building Thermal Models for AlGaN/GaN
HEMTs: Simplifications and Beyond

TRACK 11 HEAT TRANSFER IN ELECTRONIC EQUIPMENT (K16) Technical Paper Publication. HT2016-7383

Mohammad Azarifar, Nazli Donmezer, Middle East Technical University,
HEAT TRANSFER IN ELECTRONIC EQUIPMENT
(MOBILE DEVICES, LEDS, PHOTONICS ETC) Ankara, Turkey
1-2 ACTIVE HEAT-SINKS
Thornton Lounge 8:30am - 10:10am
2:20pm High Resolution Temperature Measurement of GaN-based
Session Chair: Vivek Sahu, Qualcomm, San Diego, CA, United States
Transistors under Different Bias Conditions
Session Co-Chair: Yoon Jo Kim, Washington State University Vancouver, Technical Presentation. HT2016-7406
Vancouver, WA, United States
Banafsheh Barabadi, Kevin Bagnall, Daniel Piedra, Tomas Palacios,
Evelyn Wang, Massachusetts Institute of Technology, Cambridge, MA,
8:30am A Comparison of Numerical Strategies for Optimal Liquid United States, David McCloskey, Trinity College Dublin, Dublin, Ireland
Cooled Heat Sink Design
Technical Paper Publication. HT2016-7076
2:40pm Power Packaging Thermal Model for Parametric Analyses
Ali C. Kheirabadi, Dominic Groulx, Dalhousie University, Halifax, NS, Technical Presentation. HT2016-7436
Canada
Lauren M. Boteler, U.S. Army Research Laboratory, Adelphi, MD, United
States
8:55am Novel Jet Impingement Array Geometries through 3D Printed
Manifolds
3:00pm Experimental Investigation of Thermal Management of Tablet
Technical Presentation. HT2016-7216
Computers using Phase Change Materials (PCMs)
Evan M. Glanzer, Gregory J. Michna, South Dakota State University, Technical Paper Publication. HT2016-7067
Brookings, SD, United States
Tousif Ahmed, Maha Bhouri, Samer Kahwaji, Dominic Groulx, Mary
Anne White, Dalhousie University, Halifax, NS, Canada
9:20am Fluid Dynamics, Heat Transfer and Manufacturing Limits of a
Liquid cooled Micro-feature Heat Sink
3:20pm Numerical Evaluation of Multiple Phase Change Materials for
Technical Presentation. HT2016-7538
Pulsed Electronics Applications
Noris Gallandat, Technical Consultant, Atlanta, Vaud, Switzerland, Rhett Technical Paper Publication. HT2016-7223
Mayor, DHX Machines, Hoschton, GA, United States
David Gonzalez-Nino, Pedro O. Quintero, Universidad de Puerto Rico,
Mayagüez, PR, United States, Lauren M. Boteler, Dimeji Ibitayo, Nicholas
R. Jankowski, U.S. Army Research Laboratory, Adelphi, MD, United States
HEAT TRANSFER IN ELECTRONIC EQUIPMENT
(MOBILE DEVICES, LEDS, PHOTONICS ETC)
1-3 THERMAL MANAGEMENT OF POWER ELECTRONICS
Thornton Lounge 2:00pm - 3:40pm HEAT TRANSFER IN ELECTRONIC EQUIPMENT
Session Chair: Joshua Gess, Oregon State University, Corvallis, OR, United (MOBILE DEVICES, LEDS, PHOTONICS ETC)
States 1-4 THERMAL MANAGEMENT GENERAL
Thornton Lounge 4:00pm - 5:40pm
Session Co-Chair: Banafsheh Barabadi, MIT, Cambridge, MA, United
Session Chair: Gregory J. Michna, South Dakota State University,
States
Brookings, SD, United States
Session Co-Chair: Dominic Groulx, Dalhousie University, Halifax, NS,
Canada 43