Page 28 - ASME ISPS 2016 Program

ISPS Technical Sessions

MONDAY, JUNE 20 TUESDAY, JUNE 21

Technical Publication. ISPS2016-9601
KEYNOTE ADDRESS
Grand Ballroom BCD 8:00am – 9:15am
Jang Hyun Kim, Yonsei Univeristy, Seoul, Korea (Republic), Hyunseok
Yang, Yonsei University, Seoul, Korea (Republic)
Translating IoT Into Innovation at Every Level
An Effective System-Level Vibration Prediction Analysis Approach For
Data Storage System Chassis Prith Banerjee, Schneider Electric
Technical Publication. ISPS2016-9565 For more information see page 12

Jiaping Yang, Data Storage Institute, A*Star, Singapore, Singapore,
Cheng Peng Tan, Data Storage Institute, A-STAR, Singapore, Singapore,
Zhimin He, Data Storage Institue, Singapore, Singapore, Zhi Yong Ching, 1-3
TRIBOLOGY, HEAD/MEDIA INTERFACE
Chye Chin Tan, Data Storage Institute, A*STAR, Singapore, Singapore
Grand Ballroom A 9:30am – 11:00am
LSB Page Read-rewrite Based Retention Error Recovery Scheme
For MLC NAND Flash Memories Session Organizer: Takayuki Yamamoto, Western Digital Technologies,
Inc., San Jose, CA, United States
Technical Publication. ISPS2016-9577
Session Co-Organizer: Andrey Ovcharenko, Western Digital
Haozhi Ma, Yongsheng Gong, Lu Wang, Peng Guo, Technology and
Technologies, Inc., San Jose, CA, United States
Engineering Center for Space Utilization, Chinese Academy of Sciences,
Beijing, China An Effective Solid Lubricate Stack of Graphene Oxide and its Reduzate
Energy Savings in Cloud Computing: Conventional Versus Cloud Technical Publication. ISPS2016-9600
Energy Use
Yang Wei, Xu Jianfeng, Huazhong University of Science and Technology,
COFFEE NETWORKING BREAK
Technical Publication. ISPS2016-9627 Wuhan, China
Grand Ballroom Foyer 3:45pm – 4:00pm
Daniel Comperchio, Willdan Energy Solutions, Chicago, IL, United States Simulation at of Contact at Head and Multilayer Disk Interface Under
Quasi-Static Condition
PANEL: SEMICONDUCTOR MANUFACTURING; HOW WILL PACKAGING
INFRASTRUCTURE EVOLVE OVER THE NEXT 10 YEARS? COFFEE NETWORKING BREAK Technical Publication. ISPS2016-9607
Grand Ballroom BCD 4:00am – 6:00pm Grand Ballroom Foyer 3:45pm – 4:00pm
Ao Hongrui, Han Zhiying, Zhang Kai, Jiang Hongyuan, Harbin Institute
of Technology, Harbin, China
Moderator: Dan Hutcheson, CEO, VSLI Research PANEL: SEMICONDUCTOR MANUFACTURING; HOW WILL PACKAGING A Method to Measure the Media Lubricant Loss After HAMR Recording
INFRASTRUCTURE EVOLVE OVER THE NEXT 10 YEARS?
Gaurang Choksi, Intel
Grand Ballroom BCD 4:00pm – 6:00pm Technical Publication. ISPS2016-9608
Bahgat Sammakia, SUNY Binghampton
Dongbo Li, Shaomin Xiong, David Braunstein, Xing-cai Guo, Sripathi
Bryan Black, AMD Moderator: Dan Hutcheson, CEO, VSLI Research Canchi, Qing Dai, HGST, A Western Digital Company, San Jose, CA,
United States
John Xie, Intel / Altera Gaurang Choksi, Intel
Experimental Investigation of the Effect of Hydrocarbon Oil Contamina-
Jason Marsh, NextFlex Bahgat Sammakia, SUNY Binghampton tion on A Disk Surface
Bryan Black, AMD Technical Publication. ISPS2016-9610

John Xie, Intel / Altera Young Seo, Center for Memory and Recording Research, La Jolla, CA,
United States, Andrey Ovcharenko, Western Digital Technologies, Inc.,
Jason Marsh, NextFlex
San Jose, CA, United States, Yongqi Yan, UC San Diego, La Jolla, CA,
United States, Frank Talke, University of California San Diego, La Jolla,
CA, United States

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