Page 47 - ASME ISPS 2016 Program
P. 47

At-A-Glance


                                    ISPS: 7-1 Mechatronics, Robotics,   and Automation  and Automation  ISPS: 9-1: Optical Storage and  Future Technologies and  11-1:  Storage System and Future   Technologies  ISPS: 5-1 Spindle Motor and  Acoustics, Shock and Flow   Induced Vibrations  and Automation  ISPS: 6-1: Micro/Nano   Technology and  8-1: Imaging /  Printing Technologies and    Consumer Electronics


                           Portland Room      ISPS: 7-2 Mechatronics, Robotics,   Portland Room  ISPS: 7-3 Mechatronics, Robotics,













                           Grand Ballroom A  ISPS: 1-1:  Tribology, Head/Media   Interface  ISPS: 1-2: Tribology, Head/Media   Interface  ISPS: 3-1: Servo Control Technol- ogy and   10-1: Flexible Media  Mechanics and Tape Storage  Grand Ballroom A  ISPS: Track 1-3:  Tribology, Head/  Media Interface  ISPS: Track 1-4:  Tribology, Head/  Media Interface  ISPS: 2-1: Actuator / Suspension  and Sensors and  4-1: Shock and  Flow Induced Vibrations








                               Keynote Breakfast (Grand Ballroom BCD)                                             Panel Session (Grand Ballroom BCD)

                      PROGRAM At A GLANCE
                           Santa Barbara Room  Scott Scheeler, Cisco Systems IPW: Research Centers–Strategic   Roadmaps  IPW: Heterogeneous Integration  Keynote Lunch (Grand Ballroom BCD) Steven Campbell, Western Digital  IPW: IoT Packaging - Edge    Computing  Panel Session (Grand Ballroom BCD) Semiconductor Manufacturing; How Will Packaging Infrastructure Evolve Over the Next 10 Years?  Santa Barbara Room Keynote Breakfast (Grand Ballroom BCD) Prith Banerjee, Schneider Electric  IPW: Strategic Directions in    Materials Development  IPW












                                    IoT: Thermal Challenges in Con-  Devices  IoT: Applications, Connectivity,   Security & Standards  IoT: Software & Cloud Platforms  IoT: Packaging Roadmap  IoT: Stacked Die Enablement  IoT: Reliability and Availability   from Packaging POV

                           Seattle Room  sumer Electronics and Handheld       Seattle Room













                           Grand Ballroom E  IoT: Sensing Systems  IoT: Engineered Systems  IoT: Thermal Management of  Packages Used in Automotive   Electronics  Grand Ballroom E  IoT: Data Center 1  IoT: Data Center 2  IoT: Data Sensing, Communica- tion and Autonomousness for IoT













                            MONDAY  8:00am – 9:15am  9:30am – 11:00am  11:15am – 12:45pm  12:45pm – 2:15pm  2:15pm – 3:45pm  4:00pm – 6:00pm  TUESDAY  8:00am – 9:15am  9:30am – 11:00am   11:15am – 12:45pm  12:45pm – 2:15pm  2:15pm – 3:45pm  4:00pm – 6:00pm  47


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          ISPS/IOT/IPW Program-june16r4.indd   47                                                                        6/9/16   2:08 PM
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