Page 66 - ASME DSCC 2015 Program

Technical Program

FRIDAY, OCTOBER 30 Active Wide-Band Vibration Rejection for Semiconductor
Manufacturing Robots
InVITED SESSIon Invited session paper. DSCC2015-9776
2-8-1 fA1 Vibration and Control of Smart Structures/Mech Systems
Zining Wang, Tsinghua University, Beijing, China, Cong Wang, New Jersey
George Bellows A 10:00am–12:00pm
Institute of Technology, Newark, NJ, United States, Masayoshi Tomizuka,
University of California, Berkeley, CA, United States
Session Organizer: Rifat Sipahi, Northeastern University
Currently, the semiconductor manufacturing industries over the world are
Session Organizer: Dumitru Caruntu, University of Texas Pan American
upgrading from processing 300mm wafers to processing 450mm wafers.
Session Organizer: lei Zuo, Virginia Tech
In order to satisfy the requirements of producing and processing 450mm
Session Organizer: Weidong Zhu, University of Maryland
wafers, vibration control of wafer handling tools has to make new break-
Session Organizer: Jiong Tang, University of Connecticut
throughs. This paper introduces an active wide-band vibration rejection
Session Chair: Cornel Sultan, Virginia Tech
method with a vibrotactile actuator and applies it to a wafer transfer robot.
Session Co-Chair: Yiming Zhao, Halliburton
Compared to conventional methods based on motor control of the robot, ac-
Vibration Suppression Based on Adaptive feedforward Control With tive vibration cancellation with a separate actuator does not risk compromis-
Infinite Impulse response filter ing the tracking accuracy of wafer transfer motions. A three-step controller
Invited session paper. DSCC2015-9752 synthesis scheme is developed by analyzing and combining the strengths of
several control strategies. Experimental validation shows a vibration reduc-
Shiying Zhou, University of California Berkeley, Albany, CA, United States,
Masayoshi Tomizuka, University of California, Berkeley, CA, United States tion of more than 40% in energy and 30% in amplitude.
Sensor fusion for Vibration Suppression Implemented on Arduino and
This paper presents adaptive feedforward control for vibration suppression
Raspberry Pi
based on an infinite impulse response (IIR) filter structure. The vibration
Invited session paper. DSCC2015-9816
signal and the output signal are available for the algorithm to adaptively
update the parameters of the vibration transmission path (VTP) dynamics. Ryan Krauss, Southern Ill University, Edwardsville, IL, United States
Two designs for parameter adaptation are proposed. They provide different Arduino microcontrollers are popular and easy-to-program and can be a
methods to get the necessary signals for parameter adaptation of the IIR great option for student-owned control hardware or other embedded control
filter which is different from the conventional finite impulse response (FIR) applications. This paper investigates whether or not an Arduino microcon-
filter adaptation design. Performance of the proposed designs is compared troller has the computational power to implement a sensor fusion observer/
with the conventional Filtered-x Least Mean Square (FxLMS) method on a controller for vibration suppression of a slewing beam. An additional
hard disk drive (HDD) benchmark problem. The simulation results show that approach based on combining the Arduino with a Raspberry Pi is also
the proposed designs have smaller 3sigma value and peak to peak value at investigated. Somewhat surprisingly, an Arduino microcontroller is exper-
steady state. imentally shown to be capable of implementing a sensor fusion observer
Dynamics Modeling of Clamping System Considering Characteristics of and state-space controller for a system with seven states. The floating-point
the Clamping Contact Surface matrix calculations are completed in roughly 2 milli-seconds, implying that
Invited session paper. DSCC2015-9753 real-time feedback control could have update frequencies in the range of
100-400 Hz.
Yanmin Zhao, Jianfu Zhang, Pingfa feng, Yuan Ma, Tsinghua University,
Beijing, China Cross Coupling in Parallel Kinematic MEMS nanopositioners
Contributed short paper. DSCC2015-9824
In this work, we established the dynamics model of clamping system con-
sidering the characteristics of clamping contact surface between workpiece Mohammad Maroufi, S.o. reza Moheimani, The University of Newcastle,
and chuck, while the influence of the characteristics of clamping contact Callaghan, New South Wales, Australia
surface on the clamping system was rarely considered in current research- In this paper we study the origins of the cross coupling phenomenon in
es. We obtained the dynamics parameters of the clamping system with MEMS nanopositioners with a parallel kinematic mechanism. An analytical
receptance coupling substructure analysis method. The frequency response model is provided for a generic 2-DOF MEMS nanopositioner. The model
function of clamping system at different cutting position was presented, accounts for the potential mechanical asymmetries present in the device
which is a foundation for analyzing the cutting stability. According to the due to microfabrication imperfections. Simulations are performed based on
study, we analyzed the role of clamping contact surface in deciding the the obtained model and compared with experimental data from a previously
dynamics of the clamping system and further influence on the prediction reported MEMS nanopositioner. A close agreement is observed between
accuracy of stable cutting limits in turning process. the analytical and experimental results, leading to a better understanding of
the phenomenon.

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