Page 40 - 2021 High-Reliability, Harsh Environment Connectivity eBook

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suppliers, including AirBorn, have designed and developed solderless compression interposers tested and proven to perform as well as soldered connectors in even harsh environments. In fact, despite the misperception that has prevented some design engineers from considering solderless compression connectors, these interposers have been field-proven in high-reliability, harsh-environment applications including military attack helicopters, missiles, FLIR systems, satellites, space launch vehicles, avionics, and airborne radar systems for years. To ensure optimal selections, simply contact your interconnect supplier to request test data as evidence of harsh-environment suitability.
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» AirBorn’s Z Series Solderless Compression Interposers have undergone extensive testing to the MIL-DTL-55302, MIL-DTL-83513, MIL-STD-202, and EIA 364 specifications and standards to verify their rugged, high-reliability performance in harsh-environment applications exposed to hazards including mechanical shock and random vibration.
How Solderless Compression Interposers Differ From Other Connectors
Solderless compression interposers differ from traditional pin-and-socket connectors in two primary ways: the mating style and the termination method.
Traditional pin-and-socket connectors are made up of two mating connectors, a plug and a receptacle. Plugs either have socket contacts that mate to pin contacts in the receptacle, or vice versa. In contrast, solderless compression interposers don’t mate with other connectors; instead, they simply sit between two PCBs, making direct contact between the mating pads on both boards.