Page 43 - New Catalogue 2012.indd
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Hitaltech RoHS 43
A group of connecting technologies 2002/95/EC www.hitaltech.com
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• Developed to connect mul� ple PCBs that are posi� oned at diff erent angles in
applica� ons where space is at a premium
• It also off ers the user more freedom when designing the electronics due to
endless PCB posi� oning op� ons
• Can be supplied in blister packaging on a reel for fully automa� c inser� on
• Polyimide insula� on
• 0.93mm pitch
• 6 to 33 posi� ons
Pitch mm mm mm 0.93
Max. number of positions 6 , 9, 11 & 22 poles
Insulation material Polyimide (PI-Foil 25µm + glue)
Insulation resistance Ω 10 8
Co-planarity tolerance mm mm mm 0.15
Min. bending radius mm 2.0
Max. bending cycles 50 times / 135°
Conductor material Cu 150µm
Current rating at 20 °C 20 °C 20 °C Amps 1
Soldering temperature °C/sec. 260/10 refl owable
Max. operating temperature °C 125
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