Page 502 - PowerPoint Presentation

CAVITE STATE UNIVERSITY
T3 CAMPUS
Department of Information Technology ITEC 90 – Network Fundamentals

There are several components that are attached to the motherboard. These include:
1. Chip – small piece of semiconducting material, where more integrated circuits are
embedded. They have standard-sized pin connectors that allows them to be attached to the
motherboard.
2. Bus - an electrical path that enables data flow between various system components.
3. Integrated Circuit (IC) – contains microscopic pathways that carry electric current. The
IC contains millions of elements such as resistors, capacitators, and transistors. Many different
kinds of chips are located in the motherboard
4. Microprocessor – this is the central processing unit on a chip.

Different variety of chip packages:
1. Dual Inline Package (DIP) – this has two parallel rows of pints that attach the chip
package to the circuit board
2. Pin Grid Array (PGA) – holds a larger number of pins because the pins are mounted on
the surface of the package.
3. Flip Chip-PGA (CF-PGA) Package – higher performance PGA packaging that places
the chip on the opposite sides of the pins.
4. Single Edge Contact (SEC) Cartridge – does not use pins but connects to one of the
edges in the motherboard.
The form factor of motherboards pertains to
the size and shape of the board. It also

describes the physical layout of the different
components and devices on the
motherboard. Various form factors exist for
motherboards:
 AT – Advanced Technology
 ATX – Advanced Technology
Extended
 Mini-ATX – Smaller footprint of ATX
 Micro-ATX – Smaller footprint of
ATX
 LPX – Low-profile Extended
 NLX – New Low-profile Extended
 BTX – Balanced Technology
Extended

17