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Enhance wafer
and device yield
with the precision
chemical engineering
and expertise of
Chemetall.
At Chemetall, we focus on increasing process efficiency for
machining and finishing high-value materials. In the Silicon
Carbide Industry, we understand the challenges that arise
when crystals are grown by bulk and epitaxial processes, and
the variety of defects that can result. Our goal is to minimize
the impact of these defects and maximize your high-quality
wafer yields.
Our experts and innovators, as part of our global team,
are locally available, in-person, ready to meet your needs.
Along with individual process support, we manufacture
a full line of products for nearly every step of Silicon
Carbide wafer development.
One major focus area is Chemo-Mechanical Polishing
(CMP) and delivering near-perfect surfaces on N-type
®
®
and Semi-Insulating SiC wafers. SABRE SABRE
MircoPol AF MircoPol CS
C Face Removal Rate 0.93 micron/hr 1.2 micron/hr
Roughness (Ra) 0.22 nm 0 .41 nm See Figure 1
Si Face Removal Rate 0.15 micron/hr 0.29 micron/hr
Roughness (Ra) 0.41 nm 0.58 nm See Figure 2
Figure 1. Sabre Micropol AF — Polished C Face Figure 2. Sabre Micropol CS — Polished Si Face
2 (Ra=0.22 nm) (Ra=0.41 nm)
