Page 11 - ASME SHTC 2019 Program
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KEyNOTE LECTURES Special Sessions
AIChE Donald Q Kern Lecture Science Foundation Industry/University Cooperative Research
Center on Energy Efficient Electronic Systems. He has held
Monday, July 15 visiting faculty appointments at Stanford University, Katholieke
10:30AM–12:10PM Universiteit Leuven, and Xi'an Jiaotong University. He is an
Grand Ballroom EF, Second Floor elected Fellow of the ASME, the American Association for the
Advancement of Science, and IEEE. He was a co-recipient of
Multi-scale Thermal Management in Information the ASME Curriculum Innovation Award (1999), Inventor
Technology, Mobile Electronics, Off-Grid Shelters, and Recognition Award from the Semiconductor Research
Urban Environments Corporation (2001), the ASME Electronic and Photonic
Packaging Division Outstanding Contribution Award in Thermal
Professor Yogendra Joshi, G.W. Woodruff School of Management (2006), ASME Journal of Electronics Packaging
Mechanical Engineering, Georgia Institute of Technology, Best Paper of the Year Award (2008), IBM Faculty Award
Atlanta, GA (2008), IEEE SemiTherm Significant Contributor Award (2009),
IIT Kanpur Distinguished Alumnus Award (2011), ASME
Abstract InterPack Achievement Award (2011), ITherm Achievement
In this presentation, some of our activities over the past two Award (2012), ASME Heat Transfer Memorial Award (2013),
decades in multi-scale thermal management of electronic and AIChE Donald Q. Kern Award (2018).
systems will be described. With the recent end of the
International Technology Roadmap for Semiconductors, which Tuesday, July 16
has guided research on thermal packaging of microprocessors 10:30AM–12:10PM
for nearly a quarter century, significantly different challenges Grand Ballroom EF, Second Floor
are on the horizon for high performance and mobile information
technology systems. Heterogeneous integration through chip Industry Perspective on Aerospace Technology Needs and
stacking promises to bring in multiple system functionalities Trends
in highly compact form factors, along with great challenges
to thermal management. Recent and ongoing research on Dr. Lesia Protsalio, Senior Director, Emerging Technologies
microfluidic cooling and sub-mm vapor chambers to address Program Office, United Technologies Research Center, East
the high heat fluxes, and localized hot spots in these Hartford, CT
applications will be discussed. High performance information
technology systems of the future will see these emerging Abstract
technologies deployed in servers and cabinets in data After many years of incremental innovation, we are in the
centers, which currently consume nearly 3% of the generated golden age of invention in aerospace. With Internet, computing,
electricity nationally, of which 20%–50% is towards thermal and auto industries leading the frontiers of innovation in the
management. Characterizing and managing air flows in data past decade, the defense aerospace industry still remains
centers to ensure adequate cooling and energy efficiency, in one of the most risk-averse sectors. Meanwhile, commercial
the presence of varying workloads is a key challenge, and technology players are highly motivated to develop new
efforts in our laboratory to address this will be discussed. technologies and are setting up to support rapid innovation.
Control of thermal systems will play an increasingly important Air transport passenger demand is expected to almost double
role in energy efficient operation of buildings and cities. The in the next 15 years and increased competition in this industry
speaker will introduce some of the challenges by considering drives the pace of technology development.
two areas of our focus, off-grid shelters and smart cities.
In this keynote lecture we will take a look at some of the
Biography most interesting and exciting developments taking place in
Yogendra Joshi is Professor and John M. aerospace technology today and concentrate on a few specific
McKenney and Warren D. Shiver Distinguished areas that are of higher interest for fundamental research.
Chair at the G.W. Woodruff School of The focus will be on the technology trends that are coming
Mechanical Engineering at the Georgia to fruition now as well as many more expected on the horizon.
Institute of Technology. His research interests Discussion around fundamental research interests will cover
are in multi-scale thermal management. He is a wide range of topics from advanced materials to additive
manufacturing and technologies enabling sustainable and
the author or co-author of nearly four hundred publications in efficient hybrid and electric aircraft.
this area, including nearly two hundred journal articles. He
received his B. Tech. in Mechanical Engineering from the Indian While currently existing technologies continue to advance and 11
Institute of Technology (Kanpur) in 1979, M.S. in Mechanical penetrate industry driving next generation aerospace products,
Engineering from the State University of New York at Buffalo further advances are required in the science, technology, and
in 1981, and Ph.D. in Mechanical Engineering and Applied engineering in such areas as quantum computing, artificial
Mechanics, from the University of Pennsylvania in 1984. He intelligence-driven automation, virtual and augmented reality,
has served as the Principal Investigator for multiple Defense and advanced electronics and sensor technologies as well
Advanced Research Projects Agency (DARPA) programs, and smart and multifunctional materials.
Office of Naval Research Consortium for Resource-Secure
Outposts (CORSO). He was Site Director for the National