Page 16 - ASME SHTC 2019 Program
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Technical Sessions – MONDAY COMPUTATIONAL HEAT TRANSFER – K-20
HEAT TRANSFER IN ELECTRONIC Track Organizer: Sandip Mazumder, Ohio State University,
EQUIPMENT – K-16 Columbus, OH, United States
Track Organizer: Amanie Abdelmessih, California Baptist Track Co-Organizer: Aaron Wemhoff, Villanova University,
University, Riverside, CA, United States Villanova, PA, United States
Track Co-Organizers: Hendrik P.J. De Bock, GE Global
Research, Schenectady, NY, United States, Seungbae Park, Topic 14-1
Binghamton University, Binghamton, NY, United States MeThoDS in CoMpuTaTional heaT TranSFer
Topic 11-1 14-1-1
Deep learning, reduced order Modeling,
11-1-1 and non-Continuum heat Transfer
numerical Modeling and Simulation Second Floor, regency ballroom G 8:30aM–10:10aM
Second Floor, regency ballroom F 8:30aM–10:10aM
Session Organizer: Leitao Chen, Rice University, Houston, TX,
Session Organizer: Gregory J. Michna, South Dakota State United States
University, Brookings, SD, United States
Session Co-Organizers: John Tencer, Sandia National
Effect of Rack Models and Buoyancy Forces on a Small Laboratories, Albuquerque, NM, United States, Matthew R.
Data Center Facility Jones, Brigham Young University, Provo, UT, United States
Technical Paper Publication. HT2019-3709
Beichao Hu, Long Phan, Cheng-xian Lin, Florida International Simulation of Fourier’s Law With the Finite Volume Discrete
University, Miami, FL, United States Boltzmann Method
Technical Presentation. HT2019-3499
Numerical Study of Gas-Liquid Two-Phase Flow in Ultra- Leitao Chen, Timothy Petrosius, Laura Schaefer, Rice
High-Aspect-Ratio Microchannel With Capillary-Structured University, Houston, TX, United States, Xiaofeng Cai, University
Wall of Delaware, Newark, DE, United States
Technical Paper Publication. HT2019-3567
Xiang Mei, Zhenyu Liu, Huiying Wu, Shanghai Jiao Tong In-Situ Thermal ROM-Based Optimization Using Borg
University, Shanghai, China MOEA: A Preliminary Study
Technical Paper Publication. HT2019-3483
Numerical Simulation of Flow Boiling in Micro Channel to Kevin Irick, Applied Technology Associates, Albuquerque, NM,
Study Bubble Dynamics United States, Erich Brown, COSMIAC at The University of
Technical Paper Publication. HT2019-3470 New Mexico, Albuquerque, NM, United States
Uday Kumar Alugoju, Satish Kumar Dubey, Arshad Javed,
Birla Institute of Technology & Science, Pilani – Hyderabad, Applying Artificial Intelligence to Modeling and
Hyderabad, India Optimization of Nanomaterials in Photovoltaics
Technical Presentation. HT2019-3666
Mine Kaya, Shima Hajimirza, Texas A&M University, College
Station, TX, United States
Thermal Transport Analysis of Aluminum Alloy Using
Machine Learning Technique
Technical Presentation. HT2019-3752
Jiaqi Wang, Seungha Shin, Ali Yousefzadi Nobakht, J. Dean
Blanks, Hassan Rezayat, The University of Tennessee,
Knoxville, Knoxville, TN, United States, Dongwon Shin,
Sangkeun Lee, Amit Shyam, Oak Ridge National Laboratory,
Oak Ridge, TN, United States
Numerical Simulation of Melting in Metal Foam/Paraffin
Composite Phase Change Material Using a Physically More
Reasonable Macroscale Model
Technical Paper Publication. HT2019-3642
Yuanpeng Yao, Huiying Wu, Shanghai Jiao Tong University,
Shanghai, China
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