Page 23 - ASME SHTC 2019 Program
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Technical Sessions – MONDAY
HEAT TRANSFER IN MULTIPHASE SYSTEMS – HEAT TRANSFER IN ELECTRONIC
K-13 EQUIPMENT – K-16
Track Organizer: Abhijit Mukherjee, CSUN, Northridge, CA, Track Organizer: Amanie Abdelmessih, California Baptist
United States University, Riverside, CA, United States
Track Co-Organizer: Scott Thompson, Auburn University, Track Co-Organizers: Hendrik P.J. De Bock, GE Global
Auburn, AL, United States, Vinod Srinivasan, University of Research, Schenectady, NY, United States, Seungbae Park,
Minnesota Twin Cities, Minneapolis, MN, United States Binghamton University, Binghamton, NY, United States
Topic 8-1 Topic 11-1
8-1-2 4:00pM–5:40pM 11-1-3 4:00pM–5:40pM
Condensation heat Transfer i heat Sinks and Capillary Flow
Second Floor, regency ballroom e Second Floor, regency ballroom F
Session Organizer: Scott Thompson, Auburn University, Session Organizer: Amanie Abdelmessih, California Baptist
Auburn, AL, United States University, Riverside, CA, United States
Session Co-Organizer: Mirza Mohammed Shah, Engineering Session Co-Organizer: Kashif Nawaz, ORNL, Oak Ridge, TN,
Research Associates, Redding, CT, United States United States
Numerical Investigation on Pool Boiling Over a Vertical Capillary-Enhanced Filmwise Condensation in Porous
Tube Coupled With In-Tube Condensation Media: Effect of the Wick Thickness on Condensation
Enhancement
Technical Paper Publication. HT2019-3442
Technical Presentation. HT2019-3615
Shuai Ren, City University of Hong Kong, Hong Kong,
Wenzhong Zhou, Sun Yat-sen University, College Station, TX, Ruisong Wang, Karan Jakhar, Dion Antao, Texas A&M
United States University, College Station, TX, United States
License to Chill: Delaying Surface Icing Using Phase Experimental Study on Flow and Heat Transfer of Heat Sink
Transitioning Surfaces With Ionic Wind for LED-Chip Cooling
Technical Presentation. HT2019-3443 Technical Paper Publication. HT2019-3453
Rukmava Chatterjee, Sushant Anand, University of Illinois at Jingguo Qu, Xi’an Jiaotong University, Xi’an, China, Jian-Fei
Chicago, Chicago, IL, United States, Daniel Beysens, Zhang, Xi’an Jiaotong University, Xi’an, Shaanxi, China
PMMH/ESPCI & CNRS, Paris, France
Atmosphere-Mediated Superhydrophobic Structured Pore-Scale Investigation of Electronic Device Thermal
Copper Surfaces Management Using Expanded Graphite Mixed
Microencapsulated PCM/Metal Foam Composite
Technical Presentation. HT2019-3511
Technical Presentation. HT2019-3785
Xiao Yan, Jiaqi Li, Nenad Miljkovic, University of Illinois at
Urbana-Champaign, Urbana, IL, United States, Feng Chen, Qinlong Ren, Xi’an Jiaotong University, Xi’an, Shaanxi, China,
Zhiyong Huang, Tsinghua University, Beijing, Beijing, China Cholik Chan, University of Arizona, Tucson, AZ, United States
Experimental Study of Refrigerant (R134a) Condensate
Retention on Paraffin Coated Plates and Fin Structures
Technical Paper Publication. HT2019-3508
Hong-Qing Jin, Wentao Ni, Xiaofei Wang, University of Illinois
at Urbana-Champaign, Urbana, IL, United States
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