Page 26 - ASME SHTC 2019 Program

Technical Sessions – TUESDAY HEAT TRANSFER EQUIPMENT – K-10

NANOSCALE TRANSPORT PHENOMENA – K-9 Track Organizer: Subramanyaravi Annapragada, United
Technologies Research, East Hartford, CT, United States
Track Organizer: Chris Dames, UC Berkeley, Berkeley, CA,
United States Track Co-Organizer: Gongnan Xie, Northwestern Polytechnical
Track Co-Organizer: Dong Liu, University of Houston, Houston, University, Xi’an, China
TX, United States, Liping Wang, Arizona State University,
Tempe, AZ, United States Topic 5-1
heaT TranSFer eQuipMenT
Topic 4-3
MiCro/nanoSCale phaSe ChanGe heaT 5-1-4 8:30aM–10:10aM
TranSFer heat Transfer equipment
Second Floor, Cedar ballroom b
4-3-1
Micro/nanoscale phase Change heat Transfer 1 Session Organizer: Amanie Abdelmessih, California Baptist
Second Floor, regency ballroom C 8:30aM–10:10aM University, Riverside, CA, United States

Session Organizer: Shalabh Maroo, Syracuse University, Session Co-Organizer: Kevin Anderson, California State
Syracuse, NY, United States Polytechnic University at Pomona, Pomona, CA, United States

Molecular Dynamics Simulation on the Friction Properties Design and Test of a Novel Dew-Point Evaporative Cooler
of Couette Flow With Superhydrophobic Rough Surfaces Technical Presentation. HT2019-3807
Under Different Load Liu Yuting, Li Junming, Tsinghua University, Beijing, China
Technical Paper Publication. HT2019-3729
Chengzhi Hu, Dawei Tang, Jizu Lv, Minli Bai, Xiaoliang Zhang, Expansion Bends in Heat Exchanger Tubes as an
Dalian University of Technology, Dalian, China Alternative Method to Mitigate Thermal Stress

Nanoscale Heat Transfer Across Flexible Interfaces of Technical Presentation. HT2019-3809
N-Eicosanes Libin Babu, Exergy LLC, Garden City, NY, United States
Technical Presentation. HT2019-3550
Yi Zeng, Jeyhoon Khodadadi, Jianjun Dong, Auburn University, Modified Manifold-Microchannel Heat Exchangers
Auburn, AL, United States Fabricated Based on Additive Manufacturing: Experimental
Characterization
Temperature-Dependent Wettability of Water on a Nickel
Surface at Pressurized Condition: A Molecular Dynamics Technical Paper Publication. HT2019-3535
Study
Technical Paper Publication. HT2019-3521 William C. Yameen, Nathan A. Piascik, Andrew K. Miller,
Donglei Zeng, Biao Feng, Jiawen Song, Liwu Fan, Zhejiang Riccardo C. Clemente, Jingru Benner, Anthony D. Santamaria,
University, Hangzhou, Zhejiang, China Seyed A. Niknam, Mehdi Mortazavi, Western New England
University, Springfield, MA, United States
A Molecular Dynamics Simulation of Rapid Boiling of Water
Films on Copper Plates With Different Trapezoidal
Nanochannels
Technical Paper Publication. HT2019-3577
Pu Bai, Leping Zhou, Xiaoze Du, North China Electric Power
University, Beijing, China

Experimental and Numerical Study of Wicking in Porous
Structure of Micro/Nano Channels
Technical Presentation. HT2019-3782
Sajag Poudel, An Zou, Sidharth P. Raut, Shalabh Maroo,
Syracuse University, Syracuse, NY, United States

26