Page 41 - ASME IMECE 2016 Program

Technical Program At-A-Glance

THURSDAY, NOVEMBER 17 (CONTINUED)
8:00AM–9:45AM 10:00AM–11:45AM 1:15PM–3:00PM 3:30PM–5:15PM
222C 13-9-1: Biologically Enabled 170 13-9-2: Electrokinetic 171 13-9-3: Fluid Engineering in 172 10-42-1: Thermal
Microfluidics Modeling and Micro-systems Management of Data
Applications Centers
223 13-6-1: Analysis and 170 13-17-1: Thermoelectric 172 13-17-2: Electronics and 173 13-16-1: Advanced 173
Modeling Devices and Thermal Photonics Thermal Packaging: Sensors and
Modeling Techniques Management Technologies 3D/2.5D Packaging
224A 13-18-2: High-Bandwidth 170 13-3-1: Analysis, 171 13-3-2: Analysis, Processes, 172 13-4-1: Computational 173
Packaging Challenges in a Processes, and and Technology II Studies on MEMS and
Connected World Technology I Nanostructures-I
224B 12-8-1: Instabilities in Soft 158 13-6-2: Sensors and 171 12-29-2: Static and dynamic 163
Matter Composites Actuators properties of cellular solids
225A 12-11-1: Numerical and 158 12-30-1: Mechanics of 161 12-30-2: Mechanics of 164 12-30-3: Mechanics of 166
Experimental Studies of Adhesion and Friction I Adhesion and Friction II Adhesion and Friction III
Elastomers
225B 12-32-1: Nanomechanics and 159 12-32-2: Nanomechanics 161 12-32-3: Nanomechanics 164 12-32-4: Nanomechanics 166
Nanomaterials 1 and Nanomaterials 2 and Nanomaterials 3 and Nanomaterials 4
226A 12-51-5: Modeling 159 12-51-6: Multiphysics of 162 12-51-7: Microstructure and 164 12-29-3: Mechanical 166
Soft Materials II Mechanics Behavior of Additively
Manufactured Materials
226B 12-16-3: Dynamic behaviors 159 12-16-4: Dynamic 160 12-16-5: Modeling and 163 12-16-6: Mechanical 165
of composite materials behaviors of materials and analysis of material dynamic mechanism of structure
structures: Modeling behaviors dynamic response
226C 12-6-5: Symposium Part V 158 12-6-6: Symposium Part VI 160 12-6-7: Symposium Part VII 163 12-6-8: Symposium Part VIII 165
227A 12-6-1: Symposium Part I 158 12-6-2: Symposium Part II 160 12-6-3: Symposium Part III 162 12-6-4: Symposium Part IV 165
227B 12-2-5: Radiation/High 160 12-2-6: Corrosion: Part I 162 12-2-7: Corrosion: Part II 165
temperature damage: Part
II
227C 12-18-1: Ductile Fracture I 159 12-18-2: Ductile Fracture II 161 12-18-3: Ductile Fracture III 163 12-18-4: Ductile Fracture IV 166
228A 4-9-1: Transport Phenomena 70 12-40-1: Young 161 12-40-2: Young Investigator 164 4-2-5: Damage 74
in Biomedical Applications Investigator Award Award Symposium II Biomechanics V:
Symposium I Experimental Assessments
228B 4-5-3: Breakthroughs in 69 4-2-3: Damage 70 4-2-4: Damage 72 4-14-1: Biotechnology and 74
Orthopedic Repair Biomechanics III: Brain Biomechanics IV: Military Bioengineering
Injury Mechanisms Applications
229A 4-8-1: Clinical Applications of 69 4-3-1: Vibrations and 71 4-3-2: Vibrations and 72
Bioengineering Accoustics in Biomedical Acoustics in Biomedical
Applications-Therapy Applications-Diagnostics
and Characterisation
229B 4-6-3: Biomedical Devices III 69 4-6-4: Biomedical Devices 71 4-7-1: Dynamics and Control 73 4-7-2: Dynamics and 74
IV of Biomechanical Systems I Control of Biomechanical
Systems II
230 4-10-2: Modeling in 70 4-10-3: Modeling in 71 4-10-4: Modeling in 73 4-10-5: Modeling in 74
Biomedical Applications II Biomedical Applications III Biomedical Applications IV Biomedical Applications V
231A 10-29-1: Cooling the Built 125 10-40-1: Novel interfacial 127 10-41-1: Thermal, Thermo- 128 10-14-1: Panel on ABET 129
Environment materials Mechanical Challenges in Accreditation
Packaging
231B 10-35-1: Multiscale 126
Computational Heat Transfer
Modeling and Simulation
231C
232A
232B
232C
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