Page 14 - PCMI Journal December 2021
P. 14
Pre-Treatment – Preparation of Metal Surface Sean Hill, Product Manager, Eternal Technology Corporation
In 1988, Sean started working in the printed circuit industry at Westak North as the imaging supervisor. He was tasked with converting the company from a liquid screening process to a dry film process.
In 1992, Sean left Westak for a process engineering position at Circuit Services in Bellevue, WA.
In 1997, Sean joined Circuit Image Systems in Southern California, based out of Washington State. He was a sales and service engineer for the DuPont electronics materials product line, specializing in the DuPont Riston dry film resist.
In 2003, Sean left Circuit Image Systems to become the Engineering Manager at TechniTron in Mountain View, CA.
In 2013, Sean Hill accepted a one-year contract for the position of Chief Technology officer at INB Corporation in South Korea. INB is a high-tech automated test equipment and burn-in circuit board manufacturer.
Sean Hill has held many technical positions both inside and outside of the printed circuit board industry. He has also serviced the Chemical milling industry for many years. Sean has held such positions as, Supervisor, General Manager, Director of Engineering, Technical Account Manager and Chief Technology Officer.
Sean started working for the Eternal Technology Corporation in 2014.
Abstract
This presentation reviewed all the different types of surface preparations used in the chemical milling industry.
The presentation covered both chemical and mechanical methods of surface preparation for enhanced DFR and DFSM adhesion. This webinar reviewed the process controls associated with the chemical maintenance and management for the surface treatment process.
• Concentrations • Temperatures
• Dwell / spray times • Process of records.
• Mechanical abrasive types / devices
Surface preparations are the foundations for resist adhesion in the chemical milling industry.
Issue 138 December 2021 PCMI Journal 14