Page 156 - PCMI Journal December 2020

Dry Film Resist Control Topics in Photo Chemical Milling Processes Presented by: Sean Hill, Project Manager | Eternal Technology Corporation, US
12/18/20
11.40 11.30 11.20 11.10 11.00 10.90 10.80 10.70 10.60 10.50 10.40
0.0 0.5
1.0 1.5 2.0 2.5 Mil-SF/L
3.0 3.5 4.0
LOADING CHART (CC95)
GP Resist
Acid Resist
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Expose-Develop Latitude Operating Characteristic
• Adds develop dimension to Expose Latitude Operating Characteristic.
• Reduced Breakpoint
• Stress Adhesion: Reduce Operating space at lower Exposure • Reduce line width/growth
• Increased Breakpoint
• Stress Resolution: Reduce Operating Space at higher Exposure • Increase line width/growth.
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Issue 136 December 2020 PCMI Journal 156
17
pH