Page 157 - PCMI Journal December 2020
P. 157
Dry Film Resist Control Topics in Photo Chemical Milling Processes Presented by: Sean Hill, Project Manager | Eternal Technology Corporation, US 12/18/20
35
36
SST B.P.
Expose-Develop Matrix
Resist 6/16st (Cu 7)
Resist 8/22st (Cu 9)
Resist 10/28st (Cu 11)
Low Exp Hi Dev Stress ADH
Methods
33%
Manual Exposure (Flood and collimated)
Resist Exposure Steps
55%
75%
Automatic Exposure (Flood and collimated)
Hi Exp Low Dev Stress RES
35
80 70 60 50 40 30
RES.5
BP 50%
ADH Limited
Line.4 Line.6 BP 60%
Operating Characteristic
ADH.5 LNE.5 RES.6 ADH.4 BP 40%
OPERATING AREA Reduced due to %BP Variation
RES Limited
BP 50%
6 7 8 9 10 Stouffer Step
Issue 136 December 2020 PCMI Journal 157
18
um
Developer Breakpoint
