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Seadra  Intel® Xeon® Server


                                                             Positioning        General Purpose
                                                                                2U1N2P Rack-Mounted
                                                             Form Factor        W x H x D: 438 x 87.9 x 780 mm
                                                                                (17.24 x 3.46 x 30.71 inch)
            Great Scalability and Flexibility within a                          Dual Socket; 3rd Gen Intel® Xeon® Scalable
            2U Chassis                                       Processor          Processors, TDP up to 270W
            Adopts the Intel® C621A chipset which                               32x DDR4 DIMM slots
            supports dual 3rd Gen Intel® Xeon® Scalable                         8 Channels per CPU, total 16 Channels
            processors and up to 6TB of DDR4 memory,         Memory Slot        DIMM Type: RDIMM, LRDIMM,3DS DIMM,
                                                                                BPS DIMM
            Seadra offers 40 cores, 80 threads and 32x                          3200 MT/s (2DPC)
            DDR4 DIMM slots in addition to the support                          Support Intel® Optane™ Persistent Memory
            of the Intel® Optane™ Persistent Memory. The     Chipset            Intel® C621A
            memory subsystem includes up to 8 channels                          On board 2x SATA/PCIe (x1) M.2
            per socket with 2 DPC. Also, Seadra offers a                        Front primary bays:
            PCIe Gen4 interface , which allows for up to                        Option 1: 12x 3.5’’ SAS/SATA/NVMe Hot-
            100 GbE networking as well as 7 slimline x8      Disk Drive Bay     plug Drives(up to 16x 3.5” SATA)
            PCIe 4.0 and 3x miniSAS (x4) SATA 3 for storage,                    Option 2: 24x 2.5’’ SAS/SATA/NVMe Hot-
                                                                                plug Drives
            delivering high-speed connectivity and ideal                        Rear bays:
            for High Performance Computing (HPC)                                2x 2.5'' SATA Hot-Plug Drives
            applications. Moreover, Seadra offers hot-       Expansion Slot                                                4x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
            pluggable drives with its modular front cage                        x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16
            design, ranging from regular SATA/SAS bays                       SKU A  OCP 3.0 Mezz Slot
            to a maximum 24x U.2 NVMe drives. Together                          4x PCIe Gen4 x16 (FHFL) or (FHHL) +
            with OS drive support from two internal                             1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
            M.2 SATA. Seadra is well-prepared for the                        SKU B  x16 (FHHL) + 2x SFF + 1x OCP 3.0 PCIe Gen4
            diverse scenarios of hyperconverged storage,                        x16 Mezz Slot
            including content acceleration.                                     2x PCIe Gen4 x16 (FHFLDW)  +
                                                                                1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
                                                                               SKU C  x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16
                                                                                OCP 3.0 Mezz Slot
            Serviceability and Reliability with the
            Modular Design                                                      4x additional 3.5” SATA bays in the rear +1x
                                                                               SKU D  PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16
            Designed for easy serviceability, Seadra                            (FHHL) + 2x SFF + 1x PCIe Gen4 x16 OCP 3.0
            supports many tool-less components.                                 Mezz Slot
            Moreover, in order to further enhance its        Network Controller  Optional NIC
            reliability, Seadra provides N+1 redundancy for                     10G/25G/100G NIC via OCP3.0
            both the power supplies and cooling fans.                           Support Raid/HBA standard card
                                                             Storage Controller  Onboard
                                                                                7x Slimline (x8) PCIe 4.0
                                                                                3x miniSAS(x4) SATA 3
                                                             System Management  Dedicated 1x 100M/1GbE  Base-T (AST2500)
                                                             TPM                TPM2.0 (optional)
                                                                                1+1 CRPS PSU,800W/1300W/1600W/2000W
                                                             Power Supply
                                                                                (110-220VAC) , Platinum
                                                             Fan                N+1 redundancy, 6x 6056 hot-swap fan

            About  Inventec Data Center Solutions           Inventec Corporation
            (Inventec EBG)                                  (TAO)

            Inventec Data Center Solutions (Inventec EBG) was   No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan
            established in 1998 and has been focusing on the   Tel: 886-3-390-0000    Fax: 886-3-376-2370
            design and manufacturing of server systems in Inventec   Email:  TAOproductsupport@inventec.com
            Corporation. Over decades, Inventec EBG has been the key
            server system supplier of the global branding clients.  Learn more at https://ebg.inventec.com/
        Inventec logos are trademarks or registered trademarks of Inventec Corporation.  All title and intellectual property rights in and to this document, the Specifications and
        Inventec reserves the right to modify this document, the Specifications and photos   photos contained therein, remain the exclusive property of Inventec or its suppliers.
        from time to time without notifying the Party. The entire materials provided herein   Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks
        are for reference only.                             of Intel Corporation or its subsidiaries.

                                                     © 2021 Inventec Corp.
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