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Seadra Intel® Xeon® Server
Positioning General Purpose
2U1N2P Rack-Mounted
Form Factor W x H x D: 438 x 87.9 x 780 mm
(17.24 x 3.46 x 30.71 inch)
Great Scalability and Flexibility within a Dual Socket; 3rd Gen Intel® Xeon® Scalable
2U Chassis Processor Processors, TDP up to 270W
Adopts the Intel® C621A chipset which 32x DDR4 DIMM slots
supports dual 3rd Gen Intel® Xeon® Scalable 8 Channels per CPU, total 16 Channels
processors and up to 6TB of DDR4 memory, Memory Slot DIMM Type: RDIMM, LRDIMM,3DS DIMM,
BPS DIMM
Seadra offers 40 cores, 80 threads and 32x 3200 MT/s (2DPC)
DDR4 DIMM slots in addition to the support Support Intel® Optane™ Persistent Memory
of the Intel® Optane™ Persistent Memory. The Chipset Intel® C621A
memory subsystem includes up to 8 channels On board 2x SATA/PCIe (x1) M.2
per socket with 2 DPC. Also, Seadra offers a Front primary bays:
PCIe Gen4 interface , which allows for up to Option 1: 12x 3.5’’ SAS/SATA/NVMe Hot-
100 GbE networking as well as 7 slimline x8 Disk Drive Bay plug Drives(up to 16x 3.5” SATA)
PCIe 4.0 and 3x miniSAS (x4) SATA 3 for storage, Option 2: 24x 2.5’’ SAS/SATA/NVMe Hot-
plug Drives
delivering high-speed connectivity and ideal Rear bays:
for High Performance Computing (HPC) 2x 2.5'' SATA Hot-Plug Drives
applications. Moreover, Seadra offers hot- Expansion Slot 4x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
pluggable drives with its modular front cage x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16
design, ranging from regular SATA/SAS bays SKU A OCP 3.0 Mezz Slot
to a maximum 24x U.2 NVMe drives. Together 4x PCIe Gen4 x16 (FHFL) or (FHHL) +
with OS drive support from two internal 1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
M.2 SATA. Seadra is well-prepared for the SKU B x16 (FHHL) + 2x SFF + 1x OCP 3.0 PCIe Gen4
diverse scenarios of hyperconverged storage, x16 Mezz Slot
including content acceleration. 2x PCIe Gen4 x16 (FHFLDW) +
1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4
SKU C x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16
OCP 3.0 Mezz Slot
Serviceability and Reliability with the
Modular Design 4x additional 3.5” SATA bays in the rear +1x
SKU D PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16
Designed for easy serviceability, Seadra (FHHL) + 2x SFF + 1x PCIe Gen4 x16 OCP 3.0
supports many tool-less components. Mezz Slot
Moreover, in order to further enhance its Network Controller Optional NIC
reliability, Seadra provides N+1 redundancy for 10G/25G/100G NIC via OCP3.0
both the power supplies and cooling fans. Support Raid/HBA standard card
Storage Controller Onboard
7x Slimline (x8) PCIe 4.0
3x miniSAS(x4) SATA 3
System Management Dedicated 1x 100M/1GbE Base-T (AST2500)
TPM TPM2.0 (optional)
1+1 CRPS PSU,800W/1300W/1600W/2000W
Power Supply
(110-220VAC) , Platinum
Fan N+1 redundancy, 6x 6056 hot-swap fan
About Inventec Data Center Solutions Inventec Corporation
(Inventec EBG) (TAO)
Inventec Data Center Solutions (Inventec EBG) was No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan
established in 1998 and has been focusing on the Tel: 886-3-390-0000 Fax: 886-3-376-2370
design and manufacturing of server systems in Inventec Email: TAOproductsupport@inventec.com
Corporation. Over decades, Inventec EBG has been the key
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Inventec logos are trademarks or registered trademarks of Inventec Corporation. All title and intellectual property rights in and to this document, the Specifications and
Inventec reserves the right to modify this document, the Specifications and photos photos contained therein, remain the exclusive property of Inventec or its suppliers.
from time to time without notifying the Party. The entire materials provided herein Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks
are for reference only. of Intel Corporation or its subsidiaries.
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