Page 47 - Copper and Bronze in Art: Corrosion, Colorants, Getty Museum Conservation, By David Scott
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simultaneous dissolution
                                                    of  Zn  and  Cu





            tí
            χ
            >                                      redeposition  of  Cu
            >
            tí







                                                   preferential  dissolution
                                                   of  Zn











                    F I G U R E  1.4  Potential regions in  chloride solutions for
                    dissolution of copper and zinc from alpha brass and
                    for  redeposition  of copper in chloride solutions (from
                    data of Heidersbach and Verink 1972).



             At  potentials  above  -0.90  V, the  dissolution of zinc  proceeds  by  equation  1.7, leaving
          behind a copper-enriched  surface. The reaction with chloride ion (equation 1.8) is then thought
          to  initiate the dissolution of copper  above a potential of-0.03  V, which is not far removed  from
          the experimentally determined value of 0.0  V. As the complex ion CuCl 2 ~  accumulates in solu­
          tion  near  the  surface,  C u  2 +  ions  are  generated  (equation  1.9).  The  copper(II) ions  that  are
          formed  can be reduced  to copper  directly,  as shown in equation  1.8,  or by equation  1.11 acting
                                 I
          together  with  equation  1.10. f the  copper (II)  concentration  increases,  the  half-cell  electrode
          potentials of equations  1.9,  1.10,  and  1.11 move to more  noble values. Whether  copper (II)  can
          accumulate at the surface without immediate conversion to metallic copper depends on the reac­
          tion rates of equations  1.8,1.9,1.10,  and  1.11. As the  copper (II)  concentration increases, nanto-
          kite, CuCl, becomes stable when the potential of equation  1.9 becomes more noble than that of
          equation  1.8. The deposition of metallic copper  has been verified  experimentally below +0.2 V


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